發(fā)布時間：2018-11-26 16:11

【摘要】：紙基電子器件是以環(huán)保經(jīng)濟的紙質材料為基底的柔性電子器件,相對于以高分子聚合物材料作為基底的柔性電子器件,其能夠在對折、褶皺等極端變形條件下正常工作,達到使用壽命后便于回收、銷毀,不會造成環(huán)境的污染和資源的浪費。因此,紙基電子器件的發(fā)展是未來柔性電子器件發(fā)展的重要方向之一。而作為紙基電子器件的核心,紙基柔性導線是實現(xiàn)紙基柔性電子器件互聯(lián)、通訊的關鍵,其重要性不言而喻。目前,紙基柔性導線的高電導性和高可靠性還不能兼容,采用室溫液態(tài)金屬作為彈性導電材料是解決這一問題的重要方案之一。但是,液態(tài)金屬表面張力大、難以薄膜化是制備超薄的紙基柔性導線的技術瓶頸,此外,應力作用下,紙基液態(tài)金屬導線電阻的變化規(guī)律、穩(wěn)定性還不是很清楚,這限制了紙基液態(tài)金屬導線的應用。針對上述問題,本文研究了紙基液態(tài)金屬導線的制備技術、應力作用下電阻的變化規(guī)律及其疲勞和溫度穩(wěn)定性,并探索了液態(tài)金屬導線在柔性互聯(lián)、柔性功能器件上的應用,取得的主要結果如下:(1)厚度可控的紙基液態(tài)金屬薄膜和高電導率紙基柔性導線的制備技術研究。通過超聲的方式制備了液態(tài)金屬微粒溶液,在紙基底表面沉積,形成液態(tài)金屬薄膜。通過調控基底表面單位面積的液態(tài)金屬微粒的沉積量,實現(xiàn)了紙基液態(tài)金屬薄膜厚度7μm 115μm范圍內的調控。并創(chuàng)新采用機械燒結的方式在紙基液態(tài)金屬薄膜上制備了高電導率(3.8×104 S/cm)的紙基柔性導線。(2)應變條件下紙基柔性導線可靠性和穩(wěn)定性研究。本文研究了紙基柔性導線在彎曲,對折條件下紙基導線的電阻變化規(guī)律,紙基薄膜和紙基導線在對折循環(huán)條件下工作的可靠性和穩(wěn)定性,研究了導線在長時間放置以及變溫條件下的穩(wěn)定性。研究發(fā)現(xiàn),導線在彎曲條件下隨著彎曲半徑的增大而減小,且近似成反比,恢復初始狀態(tài)后導線電阻僅變化了0.31Ω;導線對折,電阻僅改變了0.37Ω;紙基薄膜對折循環(huán)10000次,薄膜始終絕緣,導線始終導電(變化率5%);-30℃-107℃變溫條件下,導線電阻最大變化值為0.02Ω。所有這些結果都證明了紙基導線在變形條件下工作的可靠性和穩(wěn)定性。(3)紙基柔性導線的實際應用演示和回收特性研究。最后,本文探索了紙基柔性導線在紙基器件中的應用及其處理問題。發(fā)現(xiàn)由紙基柔性導線構成的紙基電路中的電子元件,在彎折條件下仍能正常工作,并且,利用NaOH溶液能夠實現(xiàn)液態(tài)金屬材料的回收,回收效率高達95.6%,節(jié)約成本,進一步證明了紙基導線的應用價值。
[Abstract]:Paper based electronic devices are flexible electronic devices based on environmentally friendly and economical paper materials. Compared with flexible electronic devices based on polymer materials, paper based electronic devices can work normally under extreme deformation conditions, such as folding, and so on. It is easy to recycle and destroy after reaching service life, which will not cause environmental pollution and waste of resources. Therefore, the development of paper-based electronic devices is one of the important directions of flexible electronic devices in the future. As the core of paper-based electronic devices, paper-based flexible wire is the key to realize the interconnection and communication of paper-based flexible electronic devices, and its importance is self-evident. At present, the high conductivity and high reliability of paper based flexible conductors are not compatible, and the use of liquid metal at room temperature as an elastic conductive material is one of the important solutions to this problem. However, the high surface tension of liquid metal and the difficulty of thinning are the technical bottlenecks in the preparation of ultra-thin paper based flexible conductors. In addition, under the action of stress, the variation of resistance of paper based liquid metal conductors is not very clear, and the stability of paper based liquid metal conductors is not very clear. This limits the application of paper-based liquid metal conductors. In order to solve the above problems, the preparation technology of paper based liquid metal conductors, the variation law of resistance under stress and its fatigue and temperature stability are studied in this paper. The application of liquid metal conductors in flexible interconnection and flexible functional devices is also explored. The main results are as follows: (1) the preparation technology of liquid metal film and paper based flexible wire with high conductivity is studied. Liquid metal particle solution was prepared by ultrasonic method and deposited on paper substrate to form liquid metal film. By adjusting the deposition amount of liquid metal particles per unit area of the substrate, the thickness of liquid metal film on paper substrate is controlled in the range of 7 渭 m ~ 115 渭 m. The paper based flexible conductors with high conductivity (3. 8 脳 10 ~ 4 S/cm) were prepared by mechanical sintering. (2) the reliability and stability of paper based flexible conductors under strain conditions were studied. In this paper, the resistance variation of paper based flexible conductors under bending and folding conditions is studied, and the reliability and stability of paper based film and paper based conductors working under the condition of folding cycle are studied. The stability of the conductor under the condition of long time placement and variable temperature is studied. It is found that the wire resistance changes only 0.31 惟 after the initial state is restored, and the resistance changes only 0.37 惟 when the wire fold, and decreases with the increase of the bending radius, and is approximately inversely proportional to the bending radius. The paper based film has 10000 fold cycles, the film is always insulated, the conductor is always conductive (change rate 5%), and the maximum change value of conductor resistance is 0.02 惟 at -30 鈩，

本文編號：2359021