本文選題：Cu-Sn粉末 + 正交試驗��； 參考：《粉末冶金工業(yè)》2017年02期

【摘要】：選用霧化法制備的低熔點高Sn含量的Cu-Sn50合金粉末進行熱壓燒結(jié)試驗,利用正交試驗方法研究燒結(jié)溫度、保溫時間和保壓壓力3個燒結(jié)因素的組合作用對粉末燒結(jié)性能的影響。通過對正交試驗數(shù)據(jù)的極差分析、試驗樣品的SEM形貌和金相組織觀察分析等,測得試樣燒結(jié)性能的變化情況及最優(yōu)試驗方案。結(jié)果表明:Cu-Sn50合金粉末在燒結(jié)溫度440℃、保溫180 s、壓力10 MPa工藝參數(shù)下各項性能較好,可作為最佳試驗方案。
[Abstract]:Cu-Sn50 alloy powder with low melting point and high Sn content was prepared by atomization method. The effects of sintering temperature, holding time and holding pressure on the sintering properties of Cu-Sn50 alloy powder were studied by orthogonal test. Through the range analysis of the orthogonal test data, SEM morphology and metallographic observation and analysis of the sample, the change of the sintered property of the sample and the optimum test scheme were obtained. The results show that the properties of the alloy powder are better under sintering temperature 440 鈩，

本文編號：2099190