本文選題：聚酰亞胺 + 熱重分析��； 參考：《哈爾濱理工大學》2014年碩士論文

【摘要】：隨著現(xiàn)代科技的迅猛發(fā)展，對材料的性能提出了更高的要求。由于聚酰亞胺具有耐高溫等特種功能，一直被廣泛應用到航空與微電子領域。為進一步提高聚酰亞胺電、熱、力學性能，將聚合物進行無機納米粒子摻雜從而進一步提高了聚酰亞胺薄膜的耐熱性能，使其熱老化壽命在一定溫度范圍內有所提高�，F(xiàn)在雜化聚酰亞胺薄膜已經成為高分子材料中耐熱性能最好的品種之一。吸引了更多的學者對其進行更加深入的研究。 隨著人們對復合材料應用的研究，發(fā)現(xiàn)在材料中加入納米粒子可以使材料的各種性能得到改善，納米粒子因其具有較高的比表面積而受到越來越廣泛地應用。加入納米粒子提高了體系的熱性能，使經由納米粒子改性的材料在綜合性能上優(yōu)于原材料，具有突出的綜合性能，進而滿足了各領域的需求。復合材料因納米粒子的發(fā)現(xiàn)而有了新的研究方向。 本文采用熱重分析法對自制的納米Al_2O_3雜化PI薄膜的熱穩(wěn)定性進行了分析，通過熱重分析方法研究雜化聚酰亞胺的熱老化壽命。采用Kissinger法求得PI薄膜在空氣和氮氣氣氛下的化學反應活化能E，同時計算出相應的碰撞系數(shù)A，計算出納米Al_2O_3摻雜含量為0wt%、4wt%、8wt%、12wt%、16wt%、20wt%、24wt%的雜化聚酰亞胺薄膜的熱老化壽命溫度。在摻雜量12wt%時，在空氣和氮氣中長期使用上限溫度最大值分別為318℃、384℃。
[Abstract]:With the rapid development of modern science and technology, higher requirements for the properties of materials are put forward. Polyimide has been widely used in aviation and microelectronics due to its high temperature resistance and other special functions. In order to further improve the electrical, thermal and mechanical properties of polyimide, the polymer was doped with inorganic nanoparticles to further improve the heat resistance of polyimide film, and the thermal aging life of polyimide film was improved in a certain temperature range. Hybrid polyimide films have become one of the best heat resistant materials. Attracted more scholars to carry out more in-depth research. With the research of composite materials, it is found that the properties of composite materials can be improved by the addition of nano-particles, and the nano-particles are more and more widely used because of their high specific surface area. The thermal properties of the system were improved with the addition of nano-particles, and the composite properties of the materials modified by nano-particles were superior to those of the raw materials, thus satisfying the needs of various fields. Composite materials have a new research direction because of the discovery of nanoparticles. The thermal stability of self-made Al_2O_3 hybrid Pi films was analyzed by thermogravimetric analysis. The thermal aging life of hybrid polyimides was studied by thermogravimetric analysis. The activation energy of chemical reaction of Pi film in air and nitrogen atmosphere was obtained by Kissinger method, and the corresponding collision coefficient A was calculated, and the thermal aging life temperature of hybrid polyimide film was calculated when the doping content of nanometer Al_2O_3 was 0 wtand 4 wtand 8 wtand 12 wtand 16 wtand 20wtand 24wt% respectively. When the doping amount is 12wt%, the upper limit temperature of air and nitrogen is 318 鈩，

本文編號：1928113