本文選題：銅銀雙金屬粉　切入點(diǎn)：致密化處理　出處：《電鍍與精飾》2016年04期

【摘要】：以銅粉為基體材料,在反應(yīng)體系中加入銅離子掩蔽劑,采用化學(xué)置換法在銅粉表面多次包覆銀及多次高溫致密化處理,實(shí)現(xiàn)了銀在銅粉表面的連續(xù)致密包覆。用X-射線衍射法、掃描電子顯微鏡、透射電子顯微鏡和熱質(zhì)量分析的方法對銀包銅雙金屬粉進(jìn)行了表征。結(jié)果表明,銅粉表面的銀包覆層致密性好、包覆完全,在800℃以下的抗氧化性能良好。
[Abstract]:Copper powder was used as substrate, copper ion masking agent was added in the reaction system, silver was coated on the surface of copper powder by chemical replacement method and densified at high temperature. The continuous dense coating of silver on the surface of copper powder was realized.The silver coated copper bimetallic powder was characterized by X ray diffraction, scanning electron microscope, transmission electron microscope and thermal mass analysis.The results showed that the silver coating on copper powder had good compactness and complete coating, and the oxidation resistance below 800 鈩，

本文編號：1700933