本文選題：熱電制冷　切入點：雙層　出處：《華北電力大學》2014年碩士論文

【摘要】：隨著微電子設備和大功率器件的發(fā)展,其相應制冷器的性能要求越來越高。熱電制冷器以其體積小,無噪聲,安全性高,制冷速度快等優(yōu)點在軍事、醫(yī)學、生物、儀器、航空、工業(yè)等領域得到廣泛應用。現(xiàn)階段對雙層熱電制冷器的數(shù)值研究多采用熱阻模型,無法考慮熱電材料隨溫度變化的物性和半導體內(nèi)電流密度分布的非均勻性等實際情況對制冷器性能的影響。本課題的研究采用溫度場和電勢場耦合的三維數(shù)值模型,分析了三種電流連接方式的雙層TEC的性能,并結合簡化共軛梯度法反向優(yōu)化了制冷器性能。 通過對串聯(lián)式、并聯(lián)式和分別式雙層TEC的數(shù)值模擬,分析了結構參數(shù)和操作參數(shù)對制冷量、COP和最大制冷溫差的影響,并根據(jù)其內(nèi)部三維溫度分布闡明不同的參數(shù)對制冷性能產(chǎn)生影響的機理。對于串聯(lián)式雙層TEC,主要的影響參數(shù)是兩層熱電單元個數(shù)比,為了提高制冷量和COP,靠近熱端的熱電單元個數(shù)與靠近冷端的個數(shù)比值大于1,本文中的最佳比值為1.73-2.33；并聯(lián)式制冷性能通常較差,不推薦使用,本文解釋了其內(nèi)部原因；分別式雙層TEC采用與串聯(lián)式最佳結構相同的個數(shù)比,通過改變兩層通入的電流比進一步提高制冷性能,通常靠近熱端一層的電流值要高于靠近冷端的,本文的最佳比值為1.50-2.00。 通過分析可知雙層TEC中不同的結構參數(shù)和操作參數(shù)均對其制冷性能有影響,且相互之間關聯(lián)緊密,因此為使雙層TEC達到最大制冷量或COP需同時優(yōu)化多個參數(shù)。本課題將簡化的共軛梯度法和熱電器件的多場耦合數(shù)學模型兩個求解器通過Fortran語言集成,進行多參數(shù)反問題最佳化。首先通過單參數(shù)研究分析面積比γ,單層熱電單元個數(shù)N,P型半導體橫截面積比a=Ap/(An+Ap),上層熱電單元高度比h=Hc/(Hc+Hh),以及操作參數(shù)電流Ic和Ih,六個參數(shù)對制冷量和COP的影響,然后分別以制冷量和COP為目標函數(shù)求取六個參數(shù)的最佳值。
[Abstract]:With the development of microelectronic devices and high-power devices, the performance requirements of the corresponding refrigerators are becoming more and more high. Thermoelectric refrigerators have the advantages of small size, no noise, high safety and high refrigeration speed in military, medical, biological, instrument, aviation, etc. Industry and other fields have been widely used. At present, thermal resistance model is widely used in the numerical research of double-layer thermoelectric refrigerators. The effect of physical properties of thermoelectric materials with temperature and nonuniformity of current density distribution in semiconductors on the performance of refrigerators can not be considered. The performance of the double-layer TEC with three kinds of current connection is analyzed, and the performance of the refrigerator is optimized by using the simplified conjugate gradient method. Through the numerical simulation of series, parallel and separate double layer TEC, the effects of structure parameters and operating parameters on the refrigerating capacity cop and maximum refrigeration temperature difference are analyzed. According to the three dimensional temperature distribution inside, the mechanism of the influence of different parameters on the refrigeration performance is explained. For the series double layer TECs, the main influence parameter is the ratio of the number of two layers of thermoelectric units. In order to increase the refrigerating capacity and COP, the ratio of the number of thermoelectric units near the hot end to the number near the cold end is greater than 1, the optimum ratio in this paper is 1.73-2.33.The performance of parallel refrigeration is usually poor and is not recommended for use. The number ratio of two-layer TEC is the same as that of series type. By changing the current ratio of two layers, the current value of one layer near the hot end is higher than that of the one layer near the cold end. The optimum ratio of this paper is 1.50-2.00. Through the analysis, it can be seen that the different structure parameters and operation parameters of double-layer TEC have influence on its refrigeration performance, and they are closely related to each other. Therefore, in order to achieve the maximum cooling capacity of double-layer TEC or COP, several parameters should be optimized at the same time. In this paper, the simplified conjugate gradient method and the multi-field coupled mathematical model of thermoelectric devices are integrated by Fortran language. The optimization of multi-parameter inverse problem is carried out. Firstly, the area ratio 緯, the number of single-layer thermoelectric units, the cross-sectional area ratio of single layer thermoelectric units, the height ratio of the upper layer thermoelectric units to h=Hc/(Hc HHH, and the operating parameter currents I c and I h, 6 are studied. The effects of these parameters on the cooling capacity and COP, Then the optimal values of six parameters are obtained by using the refrigerating capacity and COP as the objective function respectively.
【學位授予單位】：華北電力大學
【學位級別】：碩士
【學位授予年份】：2014
【分類號】：TB657

【參考文獻】

相關期刊論文 前1條

1 李開振;梁瑞生;魏正軍;;Analysis of performance and optimum configuration of two-stage semiconductor thermoelectric module[J];Chinese Physics B;2008年04期

，

本文編號：1693892