LED封裝有機(jī)硅材料的制備與性能研究
[Abstract]:Light emitting diode (LED) has many advantages compared with traditional light source, such as high efficiency, energy saving, environmental protection and long life. It has become a new generation of lighting light source and is one of the most social and economic high and new technologies in the 21st century. With the improvement of brightness and power, the performance of LED packaging materials is required higher. LED packaging materials with excellent performance in domestic market depend on import, which hinders the implementation of semiconductor lighting program with independent intellectual property rights. Based on this situation, two kinds of LED encapsulated silicone materials were prepared by additive curing and epoxy phthalic anhydride curing, and their properties were characterized. Additive liquid silicone rubber is an ideal LED packaging material due to its excellent heat resistance, aging resistance and yellowing resistance. In order to investigate the effects of various factors, such as the type of crosslinking agent, hydrogen content, vinyl silicone oil and Si-H:Si-Vi value, on the mechanical properties, light transmittance and adhesion of additive liquid silicone rubber, the formula was designed in this paper. The low refractive index (no filler), low refractive index (adding filler), high refractive index (low vinyl content silicone resin) and high refractive index (high vinyl content silicone resin) were prepared by hydrosilylation addition method. The mechanical properties, light transmittance and bond properties were characterized. The effects of crosslinking agent, hydrogen content, vinyl silicone oil and Si-H:Si-Vi value on mechanical properties, light transmittance and adhesion of additive liquid silicone rubber were obtained. This study has certain theoretical value and application value. At present, epoxy resin and silicone materials are the most widely used in the field of LED packaging. In order to prepare silicone modified epoxy resin with both advantages, In this paper, high refractive index silicone modified epoxy resin with phenyl and epoxy groups was prepared by condensation reaction of 緯-(2o 3 epoxy propyl) propyl trimethoxy silane (KH560) and diphenyl silyl diol (DPSD). The effects of catalyst, reaction temperature, reaction time and molar ratio of reactants on the properties of silicone modified epoxy resin were studied. Their structures were characterized by Fourier transform infrared spectroscopy (FT-IR) and nuclear magnetic resonance (1H NMR). Transparent silicone packaging materials were obtained after curing with methylhexahydrophthalic anhydride. The transparency, adhesion, heat resistance and mechanical properties of the cured silicone packaging materials were characterized. The results show that the silicone packaging materials have high refractive index (1.547), high transmittance (95%), excellent adhesion, good heat resistance and mechanical properties, and can be used in the field of LED packaging.
【學(xué)位授予單位】:天津大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2014
【分類號】:TN312.8;O627.41
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