環(huán)氧樹脂納米復合材料電學特性和力學特性
[Abstract]:Epoxy resin is often used as insulating material for its excellent dielectric properties, stable molding performance, good sealing performance, low linear expansion coefficient and so on. With the rapid development of modern science and technology, the insulation performance of epoxy resin is becoming more and more high, such as packaging materials mainly used in integrated circuits, printed circuit boards and other epoxy resin materials with specific low dielectric constant. Dielectric loss and high breakdown field strength. In this paper, nano-silica and nano-alumina were added to epoxy resin by mechanical blending method to prepare epoxy resin nanocomposites with different nano-contents, and the electrical and mechanical properties were tested. The dielectric properties of the materials at room temperature and variable temperature were measured by Novocontrol wide band dielectric spectrometer. The results show that both nano-alumina and nano-silica can reduce the dielectric constant and dielectric loss of epoxy resin at room temperature and variable temperature. The breakdown field strength under DC and AC is measured by AC-DC breakdown instrument. The results show that the breakdown field strength of epoxy resin can be increased by nanometer alumina and silicon oxide under both AC and negative DC voltage. The breakdown field strength of epoxy nano-alumina composites is larger than that of epoxy nano-silica composites. The mechanical properties of the machine were tested by axial tensile test. The results show that both nano-alumina and nano-silica can improve the strength limit and elastic modulus of epoxy resin, and the toughening effect is the best at 2.5 wt%. The dry and wet friction coefficients were measured by WTM-2E microscale friction and wear tester in controllable atmosphere. The results show that both nano-alumina and nano-alumina can reduce the friction coefficient of epoxy resin.
【學位授予單位】:太原理工大學
【學位級別】:碩士
【學位授予年份】:2017
【分類號】:TQ323.5;TB332
【參考文獻】
相關期刊論文 前10條
1 李佳鈮;俞科靜;錢坤;曹海建;盧雪峰;孫潔;;石墨烯/SiO_2雜化材料增強增韌環(huán)氧樹脂基復合材料[J];材料導報;2014年20期
2 孫睿;張明艷;任兆琨;隋珊;陳金玉;崔永紅;;多壁碳納米管/環(huán)氧樹脂納米復合材料電性能分析[J];絕緣材料;2012年05期
3 陳建劍;俞科靜;錢坤;曹海建;郟余晨;;石墨烯改性環(huán)氧樹脂/碳纖維復合材料拉伸性能的研究[J];化工新型材料;2012年09期
4 盧鵬薦;王一龍;孫志剛;官建國;;高介電常數、低介電損耗的聚合物基復合材料[J];化學進展;2010年08期
5 齊鑫;邸明偉;;橡膠彈性體增韌環(huán)氧樹脂的研究進展[J];粘接;2009年02期
6 李朝陽;邱大健;謝國先;肖祥定;倪曉雪;;納米SiO_2增韌改性環(huán)氧樹脂的研究[J];材料保護;2008年04期
7 楊曉軍;楊志民;毛昌輝;杜軍;;高介電常數EP/BT復合材料介電性能的研究[J];化工新型材料;2006年12期
8 王國建;郭建龍;屈澤華;;乙二胺修飾的碳納米管對環(huán)氧樹脂力學性能的影響[J];玻璃鋼/復合材料;2006年06期
9 劉揚,王士巍,秦偉;納米TiO_2對環(huán)氧樹脂力學性能的影響[J];纖維復合材料;2005年02期
10 涂春潮,齊暑華,周文英,祖恩峰;環(huán)氧樹脂增韌研究[J];化學推進劑與高分子材料;2005年03期
相關碩士學位論文 前4條
1 成如如;微米、納米以及微—納米SiO_2/LDPE復合材料中的空間電荷特性研究[D];哈爾濱理工大學;2016年
2 程妍麗;環(huán)氧樹脂基非線性復合材料介電性能研究[D];哈爾濱理工大學;2015年
3 董玲;納米粒子改性環(huán)氧樹脂性能的研究[D];北京化工大學;2012年
4 劉力偉;環(huán)氧樹脂/蒙脫土納米復合材料電導與擊穿性能研究[D];哈爾濱理工大學;2012年
,本文編號:2269975
本文鏈接:http://sikaile.net/shoufeilunwen/boshibiyelunwen/2269975.html