發(fā)布時(shí)間：2018-08-22 10:00

【摘要】：泡沫鉛是一種重要的具有三維獨(dú)特網(wǎng)狀結(jié)構(gòu)的泡沫金屬材料。其孔隙率高,比表面積大,在電池行業(yè)具有廣泛的應(yīng)用前景。本文以聚氨酯泡沫為基體,經(jīng)脫脂、粗化、導(dǎo)電化、鍍銅、鍍鉛等工藝制備出開(kāi)孔狀結(jié)構(gòu)的泡沫鉛金屬材料。 首先對(duì)聚氨酯泡沫進(jìn)行有機(jī)溶劑脫脂和化學(xué)脫脂,然后再進(jìn)行粗化、除膜,最后涂覆導(dǎo)電膠進(jìn)行導(dǎo)電化處理。 在聚氨酯泡沫基體上鍍銅工藝實(shí)驗(yàn)研究中,首先通過(guò)霍爾槽實(shí)驗(yàn)選擇鍍銅體系,得出酸性光亮鍍液最佳；然后,對(duì)酸性鍍銅的添加劑進(jìn)行實(shí)驗(yàn)研究,實(shí)驗(yàn)發(fā)現(xiàn)以NaCl和OP乳化劑為添加劑得到的銅鍍層光亮、細(xì)致,韌性好；最后探討了鍍液各組分濃度、鍍液溫度、陰極表觀電流密度、異極距、電鍍時(shí)間等工藝條件對(duì)電流效率及槽電壓的影響,得到了最佳的鍍銅工藝參數(shù),即鍍液組成為CuSO4 180g/L、H2SO4 54g/L、NaCl 0.6g/L、OP乳化劑0.4mL/L、異極距為3.5cm、陰極電流密度為3.0A/dm2、鍍液溫度為25℃、電鍍時(shí)間為35min。在此優(yōu)化條件下,電流效率高,槽電壓低,且得到的銅鍍層光亮性好、韌性好。 鍍銅泡沫基體上鍍鉛工藝實(shí)驗(yàn)研究中,主要研究了鍍鉛體系各組分濃度、陰極電流密度、鍍液溫度、電鍍時(shí)間等工藝條件對(duì)鍍鉛過(guò)程參數(shù)及鍍層質(zhì)量的影響。得到了最佳鍍鉛工藝參數(shù),即鍍液組成為pb2+115g/L、游離HBF445g/L、硼酸濃度飽和、添加劑0.5g/L、陰極表觀電流密度為3.0A/dm2、鍍液溫度為25℃、電鍍時(shí)間為30-50min。在此優(yōu)化條件下,電流效率高,槽電壓低,且得到的泡沫鉛鍍層結(jié)晶細(xì)密、均勻,且韌性和光亮性都較好,孔隙率高,具有三維網(wǎng)狀結(jié)構(gòu)。
[Abstract]:Lead foam is an important foamed metal material with three-dimensional unique mesh structure. Because of its high porosity and large specific surface area, it has wide application prospect in battery industry. In this paper, the porous lead foams were prepared by degreasing, coarsening, conducting, copper plating and lead plating with polyurethane foam as the matrix. Polyurethane foam was first degreased by organic solvent and chemical degreasing, then coarsened, removed film, and then coated with conductive adhesive for conducting treatment. In the experimental study of copper plating process on polyurethane foam matrix, firstly, the copper plating system is selected by Hall cell experiment, and the acid bright plating bath is obtained, and then the additive of acid copper plating is studied experimentally. The results show that the copper coating with NaCl and op emulsifiers as additives is bright, meticulous and good in toughness. Finally, the concentration of each component in the bath, bath temperature, cathodic apparent current density, and the distance between different electrodes are discussed. The effect of electroplating time on the current efficiency and cell voltage is obtained. The optimum copper plating parameters are obtained. The bath composition is CuSO4 180g / L _ 2SO _ 4 54g / L ~ (-1) NaCl 0.6g / L ~ (-1) op emulsifier 0.4mL / L ~ (-1), the different pole distance is 3.5cm, the cathode current density is 3.0A / d ~ (2), the bath temperature is 25 鈩，

本文編號(hào)：2196763