本文選題：有序介孔碳 + 三嵌段聚合物��； 參考：《北京化工大學(xué)》2010年碩士論文

【摘要】： 介孔材料是指孔徑介于2-50nm之間的一類多孔材料,它的孔道結(jié)構(gòu)高度有序,具有很高的比表面積,在多相催化、吸附、分離、傳感器等眾多領(lǐng)域有廣泛的應(yīng)用前景。自從1992年Mobil公司的研究人員首次報道了M41S系列的介孔材料以來,它就一直受到人們的極大關(guān)注。 分別以三嵌段聚合物F127、P123以及P123/F127復(fù)合作為模板劑,酚醛樹脂為碳前驅(qū)體,通過溶劑揮發(fā)自組裝法制備有序介孔碳材料。采用凝膠滲透色譜(GPC)測定了不同合成溫度酚醛樹脂的分子量；使用X射線衍射(XRD)、采用透射電鏡(TEM)和N2吸／脫附等手段對有序介孔碳進行了表征。研究了模板劑、合成酚醛樹脂的溫度、溶劑、.攪拌時間、溶劑揮發(fā)速率、溶液PH值及添加二氧化鈦等因素對介孔碳孔道結(jié)構(gòu)及有序性的影響。結(jié)果表明：使用復(fù)合模板劑制備的介孔的孔容和比表面積較單獨使用F127作模板分別提高了50%與31%；當m(P123)／m(F127)=1／3時,酚醛樹脂的合成溫度為85℃時、無水乙醇為溶劑、溶液PH值為7.0、攪拌時間1h所得介孔碳有較好的有序性,BET比表面積為498.5 m2／g,介孔孔容和比表面積分別為0.173cm3／g和167.05m2／g,平均孔徑為3.41nm。 采用恒流充放電、循環(huán)伏安和交流阻抗三種測試方法在氫氧化鉀電解質(zhì)中研究了介孔材料的雙電層電容器性能。結(jié)果表明：介孔材料均顯示出理想的雙電層電容行為。使用復(fù)合模板劑制備介孔碳的電極內(nèi)阻較小,比容量較大,更適合大電流充放電；在300 mA/g電流下充放電的電容量達到166 F／g,較使用單一模板劑提高了17%。
[Abstract]:Mesoporous material is a kind of porous material with pore size between 2-50nm. Its pore structure is highly ordered and has a high specific surface area. It has a wide application prospect in many fields such as heterogeneous catalysis adsorption separation sensor and so on. Since Mobil researchers first reported M41S series mesoporous materials in 1992, it has attracted great attention. The ordered mesoporous carbon materials were prepared by solvent volatilization self-assembly with triblock polymer F127P123 and P123 / F127 as template and phenolic resin as carbon precursor. The molecular weight of phenolic resin was measured by gel permeation chromatography (GPC), and the ordered mesoporous carbon was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM) and N2 adsorption / desorption. The templating agent, synthesis temperature and solvent of phenolic resin were studied. The effects of stirring time, solvent volatilization rate, pH value of solution and addition of titanium dioxide on the structure and order of mesoporous carbon channels were investigated. The results showed that the pore volume and specific surface area of the mesoporous prepared by the composite template were increased by 50% and 31%, respectively, compared with that of the F127 template alone, and when m (P123) / m (F127) 1 / 3, the synthesis temperature of phenolic resin was 85 鈩，

本文編號：2102908