本文選題：無鉛焊料 + 納米粉體�。� 參考：《昆明理工大學(xué)》2010年碩士論文

【摘要】：錫基無鉛焊料是目前替代含鉛焊料的理想材料,隨著電子工業(yè)的迅速發(fā)展,高性能錫基導(dǎo)電膠、焊膏,特別是納米級焊劑的開發(fā)研究已成為電子封裝、電子器件領(lǐng)域的重大課題。超細(xì)錫基無鉛焊料粉體作為導(dǎo)電膠以及焊膏等助焊劑的配置原材料,其品質(zhì)和產(chǎn)量已經(jīng)成為這一領(lǐng)域的關(guān)鍵問題。本課題研究了等離子法制備Sn-Zn-Bi無鉛焊料合金粉體。 目前,制備超細(xì)金屬粉體的方法有多種,本課題基于制粉過程的實(shí)用性和經(jīng)濟(jì)性考慮,始終著眼于以實(shí)現(xiàn)工業(yè)化生產(chǎn)為目的,從粉體的形成機(jī)理、使用的功能性、工藝流程的簡便和可控性幾個方面出發(fā),系統(tǒng)研究了制備過程中的各種影響因素。著重討論了粉體粒徑、形貌的影響關(guān)系以及等離子電弧法中電流強(qiáng)度、Ar流量等參數(shù)對粉體的產(chǎn)率、形貌、粒徑的影響規(guī)律,并對試驗(yàn)結(jié)果進(jìn)行討論,優(yōu)化工藝參數(shù),進(jìn)行了綜合的試驗(yàn)研究。 本實(shí)驗(yàn)首先對Sn、Zn、Bi三種純金屬粉體的制備技術(shù)進(jìn)行了研究,從實(shí)驗(yàn)中總結(jié)出等離子法制備超細(xì)金屬粉體的最優(yōu)工藝方法和技術(shù)參數(shù)。在此實(shí)驗(yàn)基礎(chǔ)上進(jìn)一步用等離子法制備比較復(fù)雜的合金焊料粉體。此時,不但要保證粉體的純度,性能等前期制粉要求,還要解決合金分餾這一關(guān)鍵性技術(shù)問題。至此,本實(shí)驗(yàn)提出了具有創(chuàng)新意義的解決方案。采用定時定量的給料方式,使被氣化的合金在最小熱容量范圍內(nèi),從而保證了被氣化金屬具有較高的蒸發(fā)速率和揮發(fā)性,以此實(shí)現(xiàn)給料量與氣化量的協(xié)同一致,強(qiáng)化了氣化效率和防止了合金的分餾。對于實(shí)驗(yàn)樣品,運(yùn)用X射線衍射(XRD),透射電鏡(TEM),差熱-分析(DSC)等現(xiàn)代檢測手段對粉體進(jìn)行表征。測試結(jié)果表明：在Ar流量為12L/min,給料量為5g/min,壓差為2100mm,電流強(qiáng)度為260A時所制得的超細(xì)無鉛焊料粉末分散性較好、粒徑分布均勻,在100nm左右,純度高,并且未發(fā)生明顯的偏析現(xiàn)象。 整個實(shí)驗(yàn)結(jié)果表明：等離子法制粉中,特殊的給料方式,實(shí)現(xiàn)了反應(yīng)室內(nèi)的連續(xù)反應(yīng),連續(xù)制粉,且在制備合金(復(fù)合)粉末時,不會產(chǎn)生金屬的分餾及偏析問題,一步反應(yīng)便可以收集到成品焊料粉體,為工業(yè)氣化法制備提供了一條嶄新的途徑。
[Abstract]:Tin based lead-free solder is an ideal material to replace lead solder. With the rapid development of electronic industry, the development and research of high performance tin based conductive adhesive, solder paste, especially nanometer flux has become electronic packaging.Major issues in the field of electronic devices.Ultrafine tin based lead-free solder powder is the raw material of conductive adhesive and solder paste. Its quality and output have become the key problem in this field.The preparation of Sn-Zn-Bi lead-free solder powder by plasma method was studied in this paper.At present, there are many methods for preparing ultrafine metal powders. Based on the practical and economical considerations in the process of powder making, this subject has always focused on the purpose of realizing industrial production, from the mechanism of powder formation and the function of use.Based on the simplicity and controllability of the technological process, various factors affecting the preparation process were systematically studied.The influence of particle size and morphology, and the influence of current intensity and ar flow rate on the powder yield, morphology and particle size are discussed. The experimental results are discussed to optimize the process parameters.A comprehensive experimental study was carried out.In this experiment, the preparation technology of three kinds of pure metal powders, Sn-Zn-Zn-Bi, was studied, and the optimum technological method and technical parameters of preparing ultrafine metal powder by plasma method were summarized from the experiment.On the basis of this experiment, the more complex alloy solder powder was prepared by plasma method.In this case, not only the powder purity and properties should be guaranteed, but also the critical technical problem of alloy fractionation should be solved.So far, this experiment has put forward the innovative solution.By means of timing and quantitative feeding, the gasified alloy is in the range of minimum heat capacity, thus ensuring the high evaporation rate and volatility of the vaporized metal, thus realizing the coordination between the feed quantity and the gasification amount.The gasification efficiency is enhanced and the fractionation of the alloy is prevented.The powder was characterized by modern methods such as X-ray diffraction (XRD), transmission electron microscopy (TEM), differential thermal analysis (DTA) and DSC.The test results show that the ultrafine lead-free solder powder prepared at ar flow rate of 12 L / min, feed rate of 5 g / min, pressure difference of 2100mm and current strength of 260A has good dispersion, uniform particle size distribution, high purity around 100nm, and no obvious segregation.The results of the whole experiment show that the special feeding method in plasma powder can realize the continuous reaction in the reaction room and the continuous powder making, and when the alloy (composite) powder is prepared, the problem of metal fractionation and segregation will not occur.The finished solder powder can be collected by one step reaction, which provides a new way for industrial gasification.
【學(xué)位授予單位】：昆明理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2010
【分類號】：TB383.1;TG42

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 段波，李克平，，趙興中;影響金屬超微粉粒徑的幾個因素[J];材料工程;1996年02期

2 魏智強(qiáng);夏天東;馬軍;張材榮;馮旺軍;閆鵬勛;;陽極弧等離子體制備鎳納米粉的機(jī)理研究[J];稀有金屬材料與工程;2007年01期

3 馬鑫,董本霞;無鉛釬料發(fā)展現(xiàn)狀[J];電子工藝技術(shù);2002年02期

4 徐駿;胡強(qiáng);林剛;張富文;;Sn-Bi系列低溫?zé)o鉛焊料及其發(fā)展趨勢[J];電子工藝技術(shù);2009年01期

5 李元山;雷曉娟;陳振華;楊石強(qiáng);;新型錫鉍系無鉛焊料的開發(fā)[J];機(jī)械工程材料;2007年05期

6 翁民玲;;電子產(chǎn)品無鉛化的對策探討[J];機(jī)電技術(shù);2007年03期

7 吳文云,邱小明,孫大謙,劉衛(wèi)紅,李明高;Sn-Zn-Bi無鉛釬料成分設(shè)計[J];吉林大學(xué)學(xué)報(工學(xué)版);2004年04期

8 張品;郭宏;楊福寶;徐駿;;Sn-Zn系無鉛焊料合金的可靠性研究進(jìn)展[J];金屬功能材料;2007年02期

9 閔文錦;宣天鵬;;錫基無鉛電子焊料的研究進(jìn)展與發(fā)展趨勢[J];金屬功能材料;2009年02期

10 李元山;雷曉娟;陳振華;;低熔點(diǎn)無鉛焊料的研制[J];計算機(jī)工程與科學(xué);2007年12期

本文編號：1765970