MEMS硅諧振式壓力傳感器設(shè)計
[Abstract]:MEMS (Micro-Electromechanical system) silicon resonant pressure sensor uses the change of its resonant frequency to measure the external environmental pressure indirectly, which has the advantages of small volume, high precision and strong anti-interference ability. In addition, the output frequency signal is quasi-digital signal, easy to connect with the back-end digital circuit. Therefore, MEMS resonant pressure sensor plays an important role in precision control, aerospace and other fields requiring high precision pressure measurement. In this paper, a kind of silicon resonant pressure sensor based on electrostatic excitation / capacitance detection is proposed. The compound structure of resonant beam and pressure film is used as the sensitive structure of the sensor. The theoretical analysis and modeling of the sensitive structure are carried out, and the simulation calculation is carried out. The displacement distribution and stress distribution of the sensitive structure under one atmospheric pressure, the relation curve of resonant frequency with pressure, and the relation curve between the maximum displacement of resonant beam and the excitation voltage are obtained. By analyzing and comparing the simulation results, the rectangular film is selected as the pressure sensitive film, the relative position of the resonant beam and the pressure film is determined, and the optimal size and the limit value of the excitation voltage of the sensitive structure are obtained. The resonant frequency of the sensitive structure is about 19 kHz,. The sensitivity is 149.37 Hz/kpa, and the maximum excitation voltage is no more than 42.5 V. On the basis of this sensitive structure, the three-layer silicon structure model of the sensor is established, and the process design is carried out: the sensor is fabricated by using a highly doped silicon wafer with resistivity of 0.005 惟 * cm; Silicon nitride is used as mask, wet etching and dry etching are combined to make sensitive structure, silicon wafers are encapsulated by au Si eutectic bonding, and convex corner corrosion data are obtained by wet etching experiment, and the layout of mask plate is drawn.
【學(xué)位授予單位】:合肥工業(yè)大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2017
【分類號】:TP212
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