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MEMS硅微諧振式壓力傳感器壓力檢測元件的設(shè)計與研究

發(fā)布時間:2018-05-26 08:18

  本文選題:壓力傳感器 + 四邊固支薄膜; 參考:《電子科技大學》2017年碩士論文


【摘要】:硅微諧振式壓力傳感器是微傳感器中重要的研究對象之一。其壓力檢測元件主要由一次敏感元件壓力膜和二次敏感元件諧振梁組成。本文研究了一種梁膜間接連接式壓力檢測元件中壓力膜的受力變形機理,該結(jié)構(gòu)通過硅島錨點將壓力膜變形撓度轉(zhuǎn)變?yōu)橹C振梁的軸向拉伸位移,通過檢測諧振梁在軸向力作用下固有頻率的變化來間接測量外界壓力。在外界載荷與諧振梁抗彎、抗拉剛度所引起的反作用力共同影響下壓力膜中軸線撓度曲線不再呈拋物線狀分布。目前,大部分文獻主要研究壓力檢測元件中薄膜承受均布載荷作用時的變形情況,理論分析時往往忽略二次敏感元件對壓力膜變形的影響,對疊加載荷下壓力膜變形機理的研究大多采用有限元仿真,缺少理論依據(jù)。本文提出了一種計算壓力膜在疊加載荷下變形撓度的解析模型,并借助此模型優(yōu)化了壓力檢測元件各結(jié)構(gòu)尺寸。給壓力傳感器設(shè)計人員提供了一種物理意義清晰、易于編程實現(xiàn)的高效分析手段,為傳感器壓力檢測元件的結(jié)構(gòu)設(shè)計提供了理論依據(jù)。本文對傳感器壓力檢測元件的研究主要分為三部分:建立壓力膜在均布載荷下的變形撓度解析模型。將壓力膜變形視為四邊固支矩形薄板的小撓度變形問題,推導出薄板變形的撓曲面表達式。在此基礎(chǔ)上,將固支薄板等效為施加了邊界分布力矩的簡支薄板。通過將簡支薄板在均布載荷、邊界力矩作用下的變形撓度相疊加,得到固支矩形薄板在均布載荷下的變形撓度,理論計算結(jié)果與數(shù)值仿真結(jié)果得到了很好的相互驗證。使用該解析模型分析了壓力膜結(jié)構(gòu)尺寸對其變形撓度的影響,以及均布載荷下薄膜的應力、內(nèi)力分布情況,以此提出壓力檢測元件的結(jié)構(gòu)優(yōu)化方案;建立壓力膜在疊加載荷下的變形撓度解析模型。在壓力膜底部施加均布載荷的同時,于上方關(guān)于中心對稱的矩形區(qū)域施加局部均勻載荷來模擬梁通過錨點施加于膜上的反作用力。同樣,去掉固支約束后將簡支薄板在上方局部均勻載荷、底部均布載荷以及邊界分布力矩作用下的變形撓度相疊加,得到固支薄板在疊加載荷作用下的變形撓度,理論計算結(jié)果與仿真結(jié)果吻合程度較高。使用該模型分析了局部載荷對壓力膜變形的影響,以此提出了硅島錨點的結(jié)構(gòu)優(yōu)化方案;結(jié)合以上兩種理論模型與有限元仿真,分析了壓力檢測元件中各部件間的相互影響,通過改變各部件結(jié)構(gòu)尺寸,研究了壓力膜變形撓度、諧振梁固有頻率以及靈敏度的影響因素,并提出合理的結(jié)構(gòu)優(yōu)化方案以提高傳感器性能。
[Abstract]:Silicon micro resonant pressure sensor is one of the important research objects in micro sensor. The pressure detecting element is mainly composed of the pressure film of the first sensitive element and the resonant beam of the second sensitive element. In this paper, the mechanism of mechanical deformation of pressure film in a kind of indirectly connected beam membrane pressure detection element is studied. The deformation deflection of pressure film is transformed into axial tensile displacement of resonant beam through silicon island anchor. The external pressure is indirectly measured by measuring the natural frequency of the resonant beam under axial force. Under the external load and the bending resistance of the resonant beam, the axial deflection curve of the pressure film is no longer parabolic due to the reaction force caused by the tensile stiffness. At present, most of the literatures mainly study the deformation of the film under uniform load in the pressure detection element, and the influence of the secondary sensitive element on the deformation of the pressure film is often ignored in the theoretical analysis. Finite element simulation is used to study the deformation mechanism of pressure film under superposition load, which is lack of theoretical basis. In this paper, an analytical model for calculating the deformation deflection of pressure film under superposition load is proposed, and the structural dimensions of the pressure detection element are optimized by the model. It provides a kind of high efficiency analysis method for the pressure sensor designer, which is clear in physical meaning and easy to realize by programming. It also provides the theoretical basis for the structure design of the pressure detection element of the sensor. In this paper, the research of the sensor pressure detection element is divided into three parts: the analytical model of the deformation deflection of the pressure film under uniform load is established. The deformation of pressure film is regarded as the small deflection of rectangular thin plate clamped on four sides, and the expression of deflection surface of thin plate is derived. On this basis, the clamped thin plate is equivalent to a simply supported thin plate with boundary distribution moment applied. By superposing the deformation deflection of simply supported thin plate under uniform load and boundary moment, the deformation deflection of clamped rectangular thin plate under uniform load is obtained. The results of theoretical calculation and numerical simulation are well verified. Using the analytical model, the influence of the structure size of the pressure film on its deformation deflection, the distribution of the stress and internal force of the film under uniform load is analyzed, and the structural optimization scheme of the pressure detection element is put forward. An analytical model of deformation deflection of pressure film under superposition load is established. At the same time, the uniformly distributed load is applied at the bottom of the pressure film, and the local uniform load is applied in the rectangular region of the center symmetry above to simulate the reaction force applied by the beam through the anchor point on the film. In the same way, when the clamping constraint is removed, the deformation deflection of the simply supported thin plate under the action of local uniform load at the top, uniform load at the bottom and the deformation deflection under the action of the boundary distributed moment are superimposed, and the deformation deflection of the clamped thin plate under the superposition load is obtained. The theoretical results are in good agreement with the simulation results. Using this model, the influence of local load on pressure film deformation is analyzed, and the structure optimization scheme of silicon island anchor point is put forward, and the interaction between the components in the pressure detection element is analyzed by combining the above two theoretical models and finite element simulation. By changing the structural dimensions of the components, the factors affecting the deformation deflection of the pressure film, the natural frequency of the resonant beam and the sensitivity are studied, and a reasonable structural optimization scheme is proposed to improve the performance of the sensor.
【學位授予單位】:電子科技大學
【學位級別】:碩士
【學位授予年份】:2017
【分類號】:TP212

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