本文選題：電子封裝　切入點(diǎn)：模具　出處：《南京航空航天大學(xué)》2017年碩士論文

【摘要】：電子封裝塑封模具表面存在溫差或溫度控制不夠精確時(shí),對(duì)封裝外殼進(jìn)行熱壓成型時(shí)會(huì)造成封裝塑料(如環(huán)氧樹(shù)脂薄膜)翹曲和失效,使得產(chǎn)品報(bào)廢。電子封裝模具的均勻加熱和恒溫控制技術(shù)可減小封裝模具表面的溫差并提高溫度控制的精度,從而改善封裝的熱壓成型工藝,提高產(chǎn)品合格率。本文以設(shè)計(jì)電子封裝機(jī)的模具加熱結(jié)構(gòu)和恒溫控制系統(tǒng)為研究?jī)?nèi)容,研究的目的在于減小封裝模具表面的溫差并提高溫度控制的精度,以此滿(mǎn)足封裝工藝的要求。主要研究?jī)?nèi)容有:(1)針對(duì)模具表面存在溫差的問(wèn)題,根據(jù)模具的結(jié)構(gòu)設(shè)計(jì)其加熱結(jié)構(gòu),并通過(guò)分區(qū)加熱設(shè)計(jì)減小模具表面的溫差,最后使用ANSYS進(jìn)行熱場(chǎng)分析,理論上驗(yàn)證設(shè)計(jì)效果。(2)針對(duì)溫度控制的精度問(wèn)題,通過(guò)機(jī)理分析法建立模具加熱過(guò)程的數(shù)學(xué)模型,選擇使用遺傳算法通過(guò)響應(yīng)曲線對(duì)數(shù)學(xué)模型進(jìn)行參數(shù)辨識(shí),最終確定模具加熱過(guò)程的傳遞函數(shù);基于溫度控制系統(tǒng)具有時(shí)滯的特性,選擇使用模糊PID-史密斯預(yù)估補(bǔ)償控制算法提高溫度控制的精度并把算法具體實(shí)現(xiàn),最終使用MATLAB仿真分析理論上驗(yàn)證了設(shè)計(jì)效果。(3)進(jìn)行恒溫控制系統(tǒng)的硬件設(shè)計(jì)和軟件設(shè)計(jì),做出整套溫度控制系統(tǒng)的解決方案。(4)進(jìn)行系統(tǒng)調(diào)試和實(shí)驗(yàn),驗(yàn)證設(shè)計(jì)方案是否達(dá)到設(shè)計(jì)指標(biāo)。
[Abstract]:When there is temperature difference on the surface of electronic packaging die or the temperature control is not accurate, the packaging plastic (such as epoxy resin film) will be warped and invalidated when the package shell is hot pressed, and the product will be scrapped.The uniform heating and constant temperature control technology of electronic packaging die can reduce the temperature difference of the die surface and improve the precision of temperature control, thus improving the hot pressing forming process of the package and increasing the qualified rate of the product.In this paper, the design of die heating structure and constant temperature control system of electronic sealing machine is studied. The purpose of the research is to reduce the temperature difference on the surface of packaging die and improve the precision of temperature control, so as to meet the requirements of packaging technology.Aiming at the problem of temperature difference on the surface of die, the heating structure is designed according to the structure of die, and the temperature difference of mold surface is reduced by zone heating design. Finally, the thermal field is analyzed by ANSYS.In view of the precision of temperature control, the mathematical model of mold heating process is established by mechanism analysis method, and the parameter identification of mathematical model is carried out by using genetic algorithm through response curve.Finally, the transfer function of the mold heating process is determined. Based on the time-delay characteristic of the temperature control system, the fuzzy PID-Smith predictive compensation control algorithm is chosen to improve the precision of the temperature control, and the algorithm is realized concretely.Finally, the MATLAB simulation analysis is used to verify the design effect. The hardware design and software design of the thermostatic control system are carried out, and the solution of the whole temperature control system is made. The system is debugged and experimented.Verify that the design plan meets the design targets.
【學(xué)位授予單位】：南京航空航天大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TQ320.52;TP273

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