基于65nm CMOS工藝高精度片上溫度傳感器設(shè)計
發(fā)布時間:2018-03-13 06:21
本文選題:CMOS 切入點:溫度傳感器 出處:《湖南大學(xué)》2016年碩士論文 論文類型:學(xué)位論文
【摘要】:隨著集成電路工藝的飛速發(fā)展和電子產(chǎn)品更新?lián)Q代不斷向著高頻率、高度集成的方向發(fā)展,芯片的溫度也隨之越來越高,芯片的功耗散熱問題也越來越嚴(yán)重。在探索散熱方法的同時,在芯片上集成溫度傳感器,用來準(zhǔn)確的感測系統(tǒng)或者單一芯片的溫度也是非常重要的。在這種背景之下,片上CMOS溫度傳感器就顯示了它獨特的優(yōu)勢。文章首先對片上溫度傳感器進(jìn)行系統(tǒng)級設(shè)計,根據(jù)設(shè)計所需的性能指標(biāo)和應(yīng)用背景選取了基于環(huán)形振蕩器結(jié)構(gòu)的頻率輸出型溫度傳感器。接著詳細(xì)地介紹了感溫模擬模塊和感溫數(shù)字模塊中主要模塊的電路結(jié)構(gòu),并對主要模塊的常用電路結(jié)構(gòu)特點進(jìn)行了比較。最后針對應(yīng)用于射頻藍(lán)牙芯片,綜合考慮精度、功耗、成本等因素,優(yōu)化設(shè)計了一款測量溫度范圍廣、精度高的片上溫度傳感器,并實現(xiàn)了所有元器件在一塊芯片上集成。電路主要模塊包括電壓跟隨器、環(huán)形振蕩器、測頻電路、數(shù)據(jù)轉(zhuǎn)換電路等。同時,為了得到更高的精度,在精度和功耗的折中考慮下,運用MATLAB工具,擬合三次方函數(shù)表示頻率和溫度的關(guān)系。整個設(shè)計過程采用格羅方德公司65nm G CMOS工藝,運用cadence公司所提供的V irtuoso工具對研究和設(shè)計的溫度傳感器進(jìn)行了電路設(shè)計,并且使用spectre電路仿真工具對各個模塊電路和整個溫度傳感器電路進(jìn)行了仿真驗證,使用calibre工具對版圖進(jìn)行DRC、LVS檢查和寄生參數(shù)提取,最后進(jìn)行后仿真驗證。芯片的工作電壓IO為3V,內(nèi)核為1.2V,整體面積為196μm×172μm。仿真結(jié)果顯示,可測量溫度范圍從-55℃-125℃,最小測量精度為±0.8℃。
[Abstract]:With the rapid development of integrated circuit technology and the upgrading of electronic products to the direction of high frequency and high integration, the temperature of chip becomes higher and higher. The problem of power dissipation and heat dissipation is becoming more and more serious. It is also very important to integrate temperature sensors into the chip to accurately detect the temperature of a single chip. The on-chip CMOS temperature sensor shows its unique advantages. First of all, the system level design of the on-chip temperature sensor is carried out. According to the performance index and application background of the design, the frequency output temperature sensor based on the ring oscillator structure is selected. Then, the circuit structure of the main modules in the temperature sensing analog module and the temperature sensing digital module is introduced in detail. Finally, aiming at the application of RF Bluetooth chip, considering the factors such as precision, power consumption, cost and so on, the paper optimizes the design of a wide range of measuring temperature. High precision on-chip temperature sensor, and all components are integrated on a single chip. The main modules of the circuit include voltage follower, ring oscillator, frequency measurement circuit, data conversion circuit, etc. At the same time, in order to obtain higher accuracy, the main modules of the circuit include voltage follower, ring oscillator, frequency measurement circuit, data conversion circuit, etc. Under the consideration of the compromise of precision and power consumption, the relationship between frequency and temperature is expressed by using the MATLAB tool. The whole design process is based on the 65 nm G CMOS process of Grovonde Company. The temperature sensor is designed by using V irtuoso tool provided by cadence Company, and the circuit of each module and the whole temperature sensor circuit is simulated and verified by spectre circuit simulation tool. The calibre tool is used to check the layout and extract the parasitic parameters. Finally, the simulation results show that the working voltage IO of the chip is 3 V, the core is 1.2 V, and the whole area is 196 渭 m 脳 172 渭 m. The simulation results show that the temperature range can be measured from -55 鈩,
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