【摘要】：隨著4G通信時代的到來以及5G通信的提出,移動通信技術以及移動通信設備發(fā)生著翻天覆地的變化。移動通信的信號傳輸頻率與傳輸速率的不斷的提高,要求移動通信印制電路板中的精細線路具有規(guī)整的形狀以及平滑的表面;移動通信設備體積的不斷減小以及IC半導體器件I/O接口的增多要求印制電路板中精細線路的密度越來越高。本文首先研究了減成法制作工藝對蝕刻參數(shù)進行了優(yōu)化,以蝕刻因子和側蝕量作為實驗指標,抗蝕層厚度,線路銅層的厚度,蝕刻液的噴淋壓力作為實驗因素進行正交實驗對蝕刻因素進行優(yōu)化,獲得了減成法蝕刻過程中的最佳參數(shù)。在最佳參數(shù)下,最大的蝕刻因子為4.90,最小的側蝕量為1.98μm。這一結果能夠滿足4G移動通信印制電路板的需求,然而隨著5G通信的到來,移動通信印制電路板的精細線路發(fā)展到35μm以下,減成法不能滿足這樣精細的線路制作要求,新的精細線路制作方法成為移動通信發(fā)展的必然。通過比較,半加成法是移動通信印制電路高密度精細線路的理想制作方法。針對半加成法種子層基材結合力不好或者沉積成本太貴的缺點,本文提出了以鎳作為種子層的新型半加成法。化學鍍鎳的沉積速率影響生產(chǎn)效率,本文采用單因素實驗優(yōu)化了化學鍍鎳的沉積速率,得到最優(yōu)的參數(shù)為:活化時間15分鐘,主鹽的濃度為25g/L,還原劑的濃度為35g/L,鍍液pH值為8.5,施鍍溫度為85℃。選擇型號為SZ-1235的杜邦干膜作為抗電鍍干膜;選取電流密度為0.8A/dm2,電鍍時間為120分鐘;選擇厚度為2μm的化學鎳層作為種子層,快速蝕刻時間選擇為2分鐘。在鎳層上制作精細線路后用金相顯微鏡、掃描電子顯微鏡、剝離強度測試檢測了精細線路的結果。檢測發(fā)現(xiàn),線路的表面和側面平整光潔,線路層與基材之間結合緊密,線路截面形狀非常規(guī)整,計算線路的蝕刻因子,各組精細線路的蝕刻因子基本能達到8以上。精細線路的剝離強度測試結果都滿足IPC(Institute of Printed Circuits,印制電路協(xié)會)的品質(zhì)要求。對比減成法和普通半加成法,本實驗制作的精細線路蝕刻因子更高,線路截面形狀比普通半加成法更加規(guī)整,顯然更加適合與移動通信印制電路板的生產(chǎn)。
[Abstract]:With the coming of 4G communication era and the proposal of 5G communication, mobile communication technology and mobile communication equipment are changing dramatically. The continuous improvement of the signal transmission frequency and transmission rate of mobile communication requires that the fine lines in the printed circuit board of mobile communication have regular shape and smooth surface. With the decrease of the volume of mobile communication devices and the increase of I / O interface of IC semiconductor devices, the density of fine circuits in printed circuit boards (PCB) is getting higher and higher. In this paper, the etching parameters are optimized by subtraction method. Etch factor and side etching amount are taken as the experimental indexes, the thickness of corrosion resistance layer and the thickness of copper layer on line are studied. The spray pressure of the etching solution was used as the experimental factor to optimize the etch factors and the optimum parameters in the process of subtraction etching were obtained. Under the optimum parameters, the maximum etching factor is 4.90 and the minimum side etching amount is 1.98 渭 m. This result can satisfy the demand of 4G mobile communication printed circuit board. However, with the arrival of 5G communication, the fine circuit line of mobile communication printed circuit board develops below 35 渭 m. The new fine line manufacturing method is inevitable for the development of mobile communication. By comparison, the semi-addition method is an ideal method for manufacturing high density fine circuit of printed circuit of mobile communication. A new semi-addition method with nickel as seed layer is proposed in this paper to overcome the disadvantage of poor adhesion or expensive deposition cost of seed layer by semi-addition method. The deposition rate of electroless nickel plating affects the production efficiency. In this paper, the deposition rate of electroless nickel plating is optimized by single factor experiment. The optimum parameters are as follows: activation time 15 minutes. The concentration of main salt is 25g / L, the concentration of reductant is 35g / L, the pH value of bath is 8.5, and the plating temperature is 85 鈩，

本文編號：2126486