【摘要】：電磁帶隙結(jié)構(gòu)以其獨(dú)特的性能吸引廣大學(xué)者的研究興趣，并已在微波領(lǐng)域尤其是天線領(lǐng)域得到廣泛的應(yīng)用。但是隨著集成化電路的發(fā)展和頻分復(fù)用技術(shù)的推廣，當(dāng)前的出現(xiàn)的電磁帶隙結(jié)構(gòu)難以滿足這一變革的要求，因此電磁帶隙結(jié)構(gòu)需要朝著在小型化、多頻化、寬帶化的研究方向發(fā)展。本文著重提出了一款小型化電磁帶隙結(jié)構(gòu)、雙頻平面型高阻抗表面結(jié)構(gòu)和具有三個(gè)頻段的電磁帶隙結(jié)構(gòu)，并加以理論分析和實(shí)驗(yàn)驗(yàn)證。本文的主要研究?jī)?nèi)容.可概括為： 1、本文通過在ELV-EBG(the edge-located via mushroom-type EBG[43])的貼片表面加入“C”型槽，從而提出了一款小型化電磁帶隙結(jié)構(gòu)。該“C”型槽的引入，增加了貼片表面上的電流路徑的長(zhǎng)度，從而降低了電磁帶隙結(jié)構(gòu)的諧振頻率。仿真結(jié)果表明該新型結(jié)構(gòu)與具有相同尺寸的ELV-EBG相比，中心頻率降低了2.5GHz,可實(shí)現(xiàn)縮減ELV-EBG近30.8%的尺寸。然后本文將提出的電磁帶隙結(jié)構(gòu)應(yīng)用于天線陣以降低天線單元的耦合度。結(jié)果顯示天線陣在引入該EBG結(jié)構(gòu)后，，天線陣間的隔離度也得到了提高，同時(shí)天線單元的匹配特性得到改善。 2、本文通過采用在蘑菇型電磁帶隙結(jié)構(gòu)的貼片表面開槽的方法設(shè)計(jì)出一款具有三個(gè)頻段的電磁帶隙結(jié)構(gòu)。仿真中發(fā)現(xiàn)該多頻結(jié)構(gòu)的三個(gè)頻段可以通過改變細(xì)槽的尺寸來調(diào)整，因此該結(jié)構(gòu)的三個(gè)頻段可實(shí)現(xiàn)獨(dú)立可調(diào)。 3、本文在本傳統(tǒng)型平面型高阻抗表面結(jié)構(gòu)的貼片上引入四個(gè)“Z”型槽，可顯著降低該結(jié)構(gòu)諧振頻點(diǎn).然后在此基礎(chǔ)上，在通過在該結(jié)構(gòu)基板的內(nèi)部加載金屬貼片形成多層結(jié)構(gòu)，可進(jìn)一步降低傳統(tǒng)平面型高阻抗表面結(jié)構(gòu)的諧振頻點(diǎn)。
[Abstract]:Electromagnetic band-gap structure has attracted the interest of many scholars because of its unique performance, and has been widely used in the field of microwave, especially in the field of antenna. However, with the development of integrated circuits and the popularization of frequency division multiplexing technology, the current electromagnetic band gap structure is difficult to meet the requirements of this change, so the electromagnetic band gap structure needs to be miniaturized and multi-frequency. The research direction of broadband is developing. In this paper, a miniaturized electromagnetic band gap structure, a dual frequency planar high impedance surface structure and an electromagnetic band gap structure with three frequency bands are proposed, which are theoretically analyzed and verified by experiments. The main content of this paper. It can be summarized as follows: 1. A miniaturized electromagnetic band gap structure is proposed by adding "C" groove on the surface of ELV-EBG (the edge-located via mushroom-type EBG [43]) patch. The introduction of the "C" slot increases the length of the current path on the surface of the patch, thus reducing the resonant frequency of the electromagnetic band-gap structure. The simulation results show that compared with ELV-EBG with the same size, the center frequency of the new structure is reduced by 2.5 GHz, and the size of ELV-EBG can be reduced by nearly 30.8%. Then the proposed electromagnetic band gap structure is applied to the antenna array to reduce the coupling degree of antenna elements. The results show that the isolation degree of the antenna array is improved after the introduction of the EBG structure. At the same time, the matching characteristics of antenna elements are improved. 2. In this paper, a three-band electromagnetic band gap structure is designed by using the method of grooving on the patch surface of mushroom type electromagnetic band gap structure. In the simulation, it is found that the three bands of the multi-frequency structure can be adjusted by changing the size of the thin slot. Therefore, the three frequency bands of the structure can be adjusted independently. 3. In this paper, four "Z" slots are introduced into the patch of the traditional planar high impedance surface structure, which can significantly reduce the resonance frequency of the structure. On this basis, the resonant frequency of the traditional planar high impedance surface structure can be further reduced by loading the metal patch inside the substrate to form a multilayer structure.
【學(xué)位授予單位】：華南理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TN820

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本文編號(hào)：2179978