本文選題：物聯(lián)網(wǎng)　切入點(diǎn)：RFID　出處：《南京大學(xué)》2014年碩士論文　論文類型：學(xué)位論文

【摘要】：物聯(lián)網(wǎng)是把物理對(duì)象無縫集成到信息網(wǎng)絡(luò),方便管理和識(shí)別的一種智能網(wǎng)絡(luò),其中射頻識(shí)別電子標(biāo)簽(RFID),是物聯(lián)網(wǎng)中各種技術(shù)之中的重要一種。近十年來,物聯(lián)網(wǎng)發(fā)展非常迅猛,各種技術(shù)不斷完善和成熟,其應(yīng)用成本也在不斷的降低�，F(xiàn)在物聯(lián)網(wǎng)已經(jīng)被廣泛的應(yīng)用于各個(gè)領(lǐng)域,如交通、環(huán)保節(jié)能、政府機(jī)構(gòu)、工業(yè)監(jiān)督、全球安防、家居安全、食品安全、醫(yī)療保健等等,以提高產(chǎn)品質(zhì)量,改進(jìn)生產(chǎn)管理效率。半導(dǎo)體是近半個(gè)世紀(jì)以來,全球發(fā)展迅猛的產(chǎn)業(yè)之一,半導(dǎo)體芯片的集成度的不斷提高,產(chǎn)品逐步向小批量,多品種轉(zhuǎn)換。半導(dǎo)體制造又是一個(gè)資金高度密集、流程高度復(fù)雜的加工過程,半導(dǎo)體的封裝測試過程中長期存在著用錯(cuò)設(shè)備、用錯(cuò)工具、用錯(cuò)材料、產(chǎn)品混批等問題,這些問題成為半導(dǎo)體封測生產(chǎn)管理的瓶頸。太極半導(dǎo)體(蘇州)有限公司就是屬于半導(dǎo)體封裝測試行業(yè)的一個(gè)外包加工企業(yè),他是由無錫太極實(shí)業(yè)有限公司在2012年12月從意大利獨(dú)資的新義半導(dǎo)體(蘇州)有限公司收購過來,以實(shí)現(xiàn)太極實(shí)業(yè)由紡織和紡織機(jī)械行業(yè)向半導(dǎo)體行業(yè)擴(kuò)展的戰(zhàn)略。新義半導(dǎo)體(蘇州)有限公司成立于2005年,是意大利EEMS集團(tuán)(原TI意大利)由于競爭和成本壓力,將半導(dǎo)體封測工廠遷移到蘇州。本文認(rèn)為,利用目前太極半導(dǎo)體已經(jīng)具有的復(fù)雜而且功能強(qiáng)大的信息系統(tǒng),引進(jìn)物聯(lián)網(wǎng)的RFID技術(shù)的應(yīng)用,將生產(chǎn)管理系統(tǒng)擴(kuò)展到對(duì)生產(chǎn)機(jī)器進(jìn)行合理的控制,能夠從根本上解決用錯(cuò)設(shè)備、用錯(cuò)工具、用錯(cuò)材料、產(chǎn)品混批等問題,從而大大減少半導(dǎo)體封裝測試的不良率,提高產(chǎn)品的質(zhì)量,進(jìn)一步降低企業(yè)的運(yùn)營成本,增強(qiáng)企業(yè)的競爭力。本文通過對(duì)物聯(lián)網(wǎng)的歷史和發(fā)展的介紹,以及物聯(lián)網(wǎng)技術(shù)和應(yīng)用的分析,提出將物聯(lián)網(wǎng)RFID的應(yīng)用引入到太極半導(dǎo)體的理念。再通過對(duì)太極半導(dǎo)體封裝測試的工藝流程的分析,引出太極半導(dǎo)體封裝測試過程中所面臨的生產(chǎn)管理的瓶頸問題。通過對(duì)問題的根源分析,大膽提出將物聯(lián)網(wǎng)RFID引入半導(dǎo)體封裝測試實(shí)現(xiàn)智能化生產(chǎn)管理的解決方案,并詳細(xì)闡述如何將物聯(lián)網(wǎng)RFID導(dǎo)入實(shí)現(xiàn)與生產(chǎn)管理系統(tǒng)完美結(jié)合以實(shí)現(xiàn)對(duì)生產(chǎn)機(jī)器的合理管控。最后,本文對(duì)物聯(lián)網(wǎng)RFID導(dǎo)入的成本,效益,競爭優(yōu)勢等方面作綜合的分析,闡述物聯(lián)網(wǎng)RFID如何有效地彌補(bǔ)當(dāng)前太極半導(dǎo)體的管理中的不足之處,以加強(qiáng)說明引入物聯(lián)網(wǎng)RFID的必要性。本文相信,物聯(lián)網(wǎng)技術(shù)在太極半導(dǎo)體公司管理的各個(gè)方面深入應(yīng)用,而且物聯(lián)網(wǎng)的應(yīng)用將會(huì)被其他的半導(dǎo)體封裝測試企業(yè)所采用,以至于整個(gè)半導(dǎo)體封裝測試行業(yè),隨著技術(shù)的成熟和應(yīng)用成本的逐步降低,物聯(lián)網(wǎng)的應(yīng)用可以逐步從高利潤制造行業(yè)向薄利潤制造行業(yè)的應(yīng)用擴(kuò)展,從根本上提高制造業(yè)的生產(chǎn)管理效率、提高產(chǎn)品質(zhì)量,進(jìn)而提高我們的生活水平。
[Abstract]:The Internet of things (IOT) is an intelligent network that integrates physical objects seamlessly into the information network, which is convenient to manage and identify. Among them, RFID tag is one of the most important technologies in the Internet of things. In the last decade, the Internet of things has developed very rapidly. The Internet of things has been widely used in various fields, such as transportation, environmental protection and energy saving, government agencies, industrial supervision, global security, home safety. Food safety, medical care, and so on, to improve product quality and improve production management efficiency. Semiconductor is one of the rapidly developing industries in the world in the past half century. Semiconductor manufacturing is also a highly capital-intensive, highly complex process, semiconductor packaging testing process has long existed in the wrong equipment, using the wrong tools, using the wrong materials, product batch, and so on. These problems have become the bottleneck of semiconductor closed test production management. Taiji Semiconductor (Suzhou) Co., Ltd. is an outsourcing processing enterprise in the semiconductor packaging testing industry. He was acquired in December 2012 by Wuxi Taiji Industrial Co., Ltd. from Xinyi Semiconductor (Suzhou) Co., Ltd, which is wholly owned by Italy. Xinyi Semiconductor (Suzhou) Co., Ltd. was established in 2005, is the Italian EEMS Group (formerly TI Italy) due to competition and cost pressure, This paper holds that the application of RFID technology in the Internet of things can be introduced by using the complex and powerful information system that Taiji Semiconductor already has. By extending the production management system to the reasonable control of the production machine, the problems of using the wrong equipment, using the wrong tools, using the wrong materials, using the wrong batches, etc. can be fundamentally solved, thus greatly reducing the defective rate of the semiconductor packaging test. This paper introduces the history and development of the Internet of things, and analyzes the technology and application of the Internet of things. The idea of introducing the application of Internet of things (RFID) into Taiji semiconductor is put forward. This paper introduces the bottleneck of production management in the process of Taiji semiconductor packaging testing. By analyzing the root of the problem, the solution of intelligent production management by introducing the Internet of things (RFID) into semiconductor packaging testing is put forward. And how to combine the implementation of the Internet of things RFID with the production management system in order to realize the reasonable control of the production machine. Finally, this paper makes a comprehensive analysis on the cost, benefit and competitive advantage of the introduction of the Internet of things RFID. This paper describes how the Internet of things (RFID) can effectively remedy the deficiencies in the current management of Taiji Semiconductor, so as to strengthen the necessity of introducing the Internet of things (RFID). This paper believes that the Internet of things technology has been applied in every aspect of Taiji Semiconductor Company's management. And the application of the Internet of things will be adopted by other semiconductor packaging testing enterprises, so that the whole semiconductor packaging testing industry, as technology matures and application costs gradually reduce, The application of the Internet of things can gradually expand from the high-profit manufacturing industry to the low-profit manufacturing industry, and fundamentally improve the production management efficiency and product quality of the manufacturing industry, and then improve our living standard.
【學(xué)位授予單位】：南京大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類號(hào)】：TP391.44;TN929.5;F426.63

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