硅藻土基調濕材料中熱濕耦合傳遞
發(fā)布時間:2018-10-10 12:31
【摘要】:建立了硅藻土基調濕材料內部熱濕耦合遷移一維數學模型,模擬了不同孔隙率、不同環(huán)境溫度和相對濕度下硅藻土基調濕材料中的熱濕耦合遷移過程,結合硅藻土基調濕材料調濕性能實驗測試結果以及硅藻土基調濕材料表面的顯微圖像分析,研究結果表明:隨著孔隙率的減小,硅藻土基調濕材料的吸、放濕量均增大;環(huán)境溫度對硅藻土基調濕材料熱濕耦合遷移過程影響不顯著,不同的環(huán)境溫度(最大相差20℃)對硅藻土基調濕材料吸、放濕量的影響均在10%左右;硅藻土基調濕材料的孔徑尺寸越小、小孔徑孔隙數量越多,其調濕性能越好;硅藻土基調濕材料調濕性能的實測數據、模擬結果以及圖像表征吻合良好,從而驗證了理論模型的合理性。
[Abstract]:A one-dimensional mathematical model of thermo-moisture coupling migration in diatomite keynote wet material was established, and the coupled heat and humidity migration process in diatomite keynote wet material was simulated under different porosity, different ambient temperature and relative humidity. Combined with the experimental results of moisture adjusting performance of diatomite keynote wet material and the analysis of microscopic image on the surface of diatomite keynote wet material, the results show that: with the decrease of porosity, the moisture absorption and desiccant amount of diatomite keynote wet material increase; The effect of ambient temperature on the thermal-moisture coupling migration process of diatomite was not significant. The effect of different ambient temperature (maximum difference of 20 鈩,
本文編號:2261774
[Abstract]:A one-dimensional mathematical model of thermo-moisture coupling migration in diatomite keynote wet material was established, and the coupled heat and humidity migration process in diatomite keynote wet material was simulated under different porosity, different ambient temperature and relative humidity. Combined with the experimental results of moisture adjusting performance of diatomite keynote wet material and the analysis of microscopic image on the surface of diatomite keynote wet material, the results show that: with the decrease of porosity, the moisture absorption and desiccant amount of diatomite keynote wet material increase; The effect of ambient temperature on the thermal-moisture coupling migration process of diatomite was not significant. The effect of different ambient temperature (maximum difference of 20 鈩,
本文編號:2261774
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