【摘要】：球面并聯(lián)機(jī)構(gòu)操作靈活、控制簡(jiǎn)單,尤其適合于飛行器運(yùn)動(dòng)模擬、光束指向控制及平臺(tái)調(diào)平領(lǐng)域。為了提高調(diào)平效率,提出了一種適用于調(diào)平領(lǐng)域的球面并聯(lián)機(jī)構(gòu),首先介紹該機(jī)構(gòu)構(gòu)型,由動(dòng)平臺(tái)、底座、兩對(duì)稱(chēng)分布驅(qū)動(dòng)支鏈及球副支腿構(gòu)成。針對(duì)機(jī)構(gòu)特點(diǎn),基于螺旋理論分析機(jī)構(gòu)自由度與約束,給出機(jī)構(gòu)自由度矩陣與約束矩陣,得出該機(jī)構(gòu)有2個(gè)轉(zhuǎn)動(dòng)自由度。依據(jù)構(gòu)型建立機(jī)構(gòu)坐標(biāo)系,通過(guò)構(gòu)造閉環(huán)矢量,建立驅(qū)動(dòng)長(zhǎng)度與動(dòng)平臺(tái)轉(zhuǎn)動(dòng)角度的數(shù)學(xué)模型并求得運(yùn)動(dòng)學(xué)逆解。利用3D模型進(jìn)行運(yùn)動(dòng)學(xué)仿真,求解機(jī)構(gòu)位移、速度、加速度。結(jié)果表明,所提出的機(jī)構(gòu)具有較好的位移分辨率且結(jié)構(gòu)簡(jiǎn)單,可作為倒裝鍵合等調(diào)平機(jī)構(gòu)的基礎(chǔ)件,具有很好的應(yīng)用價(jià)值。
[Abstract]:The spherical parallel mechanism is flexible in operation and simple in control, especially in the fields of aircraft motion simulation, beam pointing control and platform leveling. In order to improve the leveling efficiency, a spherical parallel mechanism suitable for leveling field is proposed. Firstly, the configuration of the mechanism is introduced, which consists of a moving platform, a base, a two-symmetrical distribution driving branch chain and a ball pair supporting leg. According to the characteristics of the mechanism, the degree of freedom and constraint matrix of the mechanism are analyzed based on the helical theory, and the mechanism freedom matrix and constraint matrix are given, and it is concluded that the mechanism has two rotational degrees of freedom. The mechanism coordinate system is established according to the configuration. By constructing the closed loop vector, the mathematical model of the driving length and the rotation angle of the moving platform is established and the inverse kinematics solution is obtained. The kinematics simulation is carried out by using 3D model, and the displacement, velocity and acceleration of the mechanism are solved. The results show that the proposed mechanism has good displacement resolution and simple structure. It can be used as the foundation of the inverted bonding and leveling mechanism, and has good application value.
【作者單位】： 上海工程技術(shù)大學(xué)機(jī)械工程學(xué)院;中國(guó)科學(xué)院光電技術(shù)研究所;
【基金】：國(guó)家自然科學(xué)基金(51305424)
【分類(lèi)號(hào)】：TH112

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