發(fā)布時間：2018-11-26 08:03

【摘要】：陽極鍵合經(jīng)過多年的發(fā)展，目前已經(jīng)被廣泛應(yīng)用于微機(jī)電系統(tǒng)(MEMS)，，已成為重要的MEMS封裝技術(shù)之一。MEMS技術(shù)將微機(jī)械技術(shù)及微電子技術(shù)相結(jié)合，是一種新興技術(shù)，可以制造出微機(jī)電系統(tǒng)。陽極鍵合技術(shù)不僅被大量應(yīng)用于微機(jī)械，微傳感器，微型儀表制造等MEMS領(lǐng)域，而且在電真空，航空航天，太陽能電池制造等領(lǐng)域中也有較高的應(yīng)用價值。當(dāng)今MEMS和其他各領(lǐng)域的快速發(fā)展，也給陽極鍵合技術(shù)提出了新的要求，目前陽極鍵合的研究方向主要集中在低溫陽極鍵合，和異質(zhì)材料陽極鍵合方面。 本文針對陽極鍵合技術(shù)中鍵合質(zhì)量和鍵合溫度的矛盾，以實(shí)現(xiàn)低溫陽極鍵合為目標(biāo)，提出了基于介質(zhì)阻擋放電的復(fù)合陽極鍵合方法，可實(shí)現(xiàn)低溫陽極鍵合。 研究了基于介質(zhì)阻擋放電的復(fù)合陽極鍵合機(jī)理，分析了復(fù)合陽極鍵合的工藝條件，搭建了復(fù)合陽極鍵合實(shí)驗(yàn)平臺，進(jìn)行了介質(zhì)阻擋放電實(shí)驗(yàn)，使介質(zhì)阻擋放電在大氣壓下呈現(xiàn)出了輝光放電的形式，證明了利用介質(zhì)阻擋放電實(shí)現(xiàn)低溫陽極鍵合是可行的。 通過實(shí)驗(yàn)，分析了各工藝參數(shù)，主要影響參數(shù)有：放電電壓、頻率、放電間隙、鍵合溫度、鍵合電壓。其中鍵合溫度仍然是最主要影響因素。
[Abstract]:After years of development, anode bonding has been widely used in MEMS (MEMS), which has become one of the important MEMS packaging technologies. MEMS technology is a new technology, which combines micromechanical technology with microelectronics technology. Micro-electromechanical systems can be made. The anodic bonding technology is not only widely used in the fields of MEMS, such as micro-machinery, micro-sensor, micro-instrument manufacture, but also has high application value in the fields of electric vacuum, aerospace, solar cell manufacture and so on. With the rapid development of MEMS and other fields, new requirements have been put forward for anodic bonding technology. At present, the research direction of anodic bonding is mainly focused on low temperature anodic bonding and anodic bonding of heterogeneous materials. Aiming at the contradiction between the bonding quality and the bonding temperature in the anodic bonding technology, a composite anodic bonding method based on dielectric barrier discharge (DBD) is proposed in this paper, which can realize the low temperature anodic bonding. The mechanism of composite anode bonding based on dielectric barrier discharge (DBD) is studied, the process conditions of composite anode bonding are analyzed, the experimental platform of composite anode bonding is built, and the dielectric barrier discharge experiment is carried out. The dielectric barrier discharge presents the form of glow discharge at atmospheric pressure, which proves that it is feasible to use dielectric barrier discharge to realize low temperature anodic bonding. The main parameters are as follows: discharge voltage, frequency, discharge gap, bonding temperature and bonding voltage. The bonding temperature is still the most important factor.
【學(xué)位授予單位】：蘇州大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2014
【分類號】：TH-39

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