本文關(guān)鍵詞：低壓鍵合技術(shù)及其機(jī)理研究　出處：《合肥工業(yè)大學(xué)》2012年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 微納流控通道 低壓鍵合 頂部填充 填充阻隔器 有限元

【摘要】：在微納流控通道中流體和分子傳輸具有特異性質(zhì)，相關(guān)研究突破了傳統(tǒng)理論的一些重要概念，并在生化等方面有重大應(yīng)用。聚合物微納流控通道的可控加工是該領(lǐng)域的研究熱點。熱鍵合是聚合物微納通道密封的關(guān)鍵技術(shù)，傳統(tǒng)熱鍵合過程由于需要高溫高壓，很容易造成通道變形和堵塞，這是制約器件化的關(guān)鍵問題。 本文提出一種在低壓下完成微納流控系統(tǒng)制造的方法,避免了傳統(tǒng)加工方法中的一些缺點。論文中給出了整個加工流程以及關(guān)鍵步驟，并進(jìn)行了流體測試。通過實驗結(jié)果可以看出，該方法能制作出大面積均勻的納米通道。 本文根據(jù)伯肅葉公式理論，，構(gòu)建微尺度下聚合物的粘度和壁面滑移模型，研究了聚合物在毛細(xì)力和鍵合壓力共同作用下頂部填充的機(jī)理，闡明了微尺度效應(yīng)和壓力、溫度、膠層厚度等工藝因素對頂部填充的影響機(jī)制；通過有限元方法，利用VOF模型，模擬了低壓鍵合過程中毛細(xì)填充過程，模擬結(jié)果和實驗結(jié)果保持一致,同時分析了形成不同形狀通道的理論條件。這些結(jié)果能有助于理解頂部填充過程，對優(yōu)化工藝參數(shù)起到很大的理論指導(dǎo)作用。 本文通過膨脹中心線的假設(shè)，設(shè)計出“填充阻隔器”結(jié)構(gòu)以降低鍵合壓力在擠壓流動過程產(chǎn)生的位移，分流填充量，從而抑制頂部填充。本文提出的低壓鍵合技術(shù),對進(jìn)一步探索聚合物微納流體系統(tǒng)加工中相關(guān)科學(xué)問題及在各領(lǐng)域的應(yīng)用都具有重要的理論意義和實用價值。
[Abstract]:In the micro-nanofluidic channel, fluid and molecular transport have special properties, and some important concepts of traditional theory have been broken through in related research. And it has great application in biochemistry and so on. The controllable processing of polymer micro-nano channel is the research hotspot in this field. Thermal bonding is the key technology of polymer micro-nano channel sealing. Due to the need of high temperature and high pressure, the traditional hot bonding process can easily lead to channel deformation and blockage, which is the key problem restricting the device. In this paper, a method of fabricating micro / nano flow control system at low voltage is proposed, which avoids some disadvantages of traditional machining methods. The whole process and key steps are given in this paper. The experimental results show that the method can produce a large area of uniform nanochannels. In this paper, the viscosity and wall slip models of polymer on microscale are constructed according to the theory of Bosule formula, and the mechanism of top filling of polymer under the action of capillary force and bonding pressure is studied. The influence mechanism of microscale effect, pressure, temperature, thickness of rubber layer on top filling is explained. Through finite element method and VOF model, the capillary filling process in low pressure bonding process is simulated, and the simulation results are consistent with the experimental results. At the same time, the theoretical conditions for the formation of different shape channels are analyzed. These results can help to understand the top filling process and play a great role in guiding the optimization of process parameters. Based on the assumption of the expansion center line, a "fill barrier" structure is designed to reduce the displacement caused by bonding pressure in the extrusion flow process and to separate the filling amount. The low pressure bonding technique proposed in this paper is of great theoretical significance and practical value for the further exploration of the related scientific problems in polymer micro-nano fluid system processing and its application in various fields.
【學(xué)位授予單位】：合肥工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2012
【分類號】：TH16

【參考文獻(xiàn)】

相關(guān)期刊論文 前1條

1 羅怡;王曉東;王立鼎;;聚合物微流控芯片的鍵合技術(shù)與方法[J];中國機(jī)械工程;2008年24期

相關(guān)博士學(xué)位論文 前1條

1 呂春華;基于SU-8負(fù)光膠的微流控芯片加工技術(shù)的研究[D];浙江大學(xué);2007年

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