【摘要】：現(xiàn)在CPU的散熱問題越來(lái)越突出。隨著電子芯片技術(shù)的飛速發(fā)展，計(jì)算機(jī)的CPU芯片呈現(xiàn)高集成化、小型化及高頻化的發(fā)展趨勢(shì)，但CPU芯片越來(lái)越高的發(fā)熱量，成為阻礙這一趨勢(shì)發(fā)展的關(guān)鍵因素。CPU芯片更進(jìn)一步的小型化及集成化發(fā)展，使電子元件單位面積產(chǎn)生的熱量大幅度的提高，提高散熱器散熱效率已成為急需解決的問題，而先進(jìn)的電子芯片散熱技術(shù)將成為解決這一問題的核心。傳統(tǒng)的芯片散熱技術(shù)受到挑戰(zhàn)，風(fēng)冷技術(shù)難以達(dá)到更高的散熱要求，具有更高散熱效果及發(fā)展前景的液體散熱技術(shù)，日益成為國(guó)內(nèi)外研究者的重要課題。 液體散熱技術(shù)是一種非常有效的散熱方式，在CPU散熱方面也有非常好的表現(xiàn)。國(guó)內(nèi)外對(duì)CPU散熱問題的研究大多集中于液體散熱器的設(shè)計(jì)和優(yōu)化上，如熱管和微槽道設(shè)計(jì)等，對(duì)于冷卻液材料的研究多是關(guān)于液態(tài)金屬這種高價(jià)格的材料上。還有就是在有機(jī)溶劑中尋找對(duì)環(huán)境友好、對(duì)人危害較小的新型冷卻液材料，用以替代污染環(huán)境的舊的冷卻液，而這一方面的研究主要集中在空調(diào)和冰箱這樣較強(qiáng)的制冷機(jī)器上面。另外在汽車發(fā)動(dòng)機(jī)上使用的納米流體的研究也較多，對(duì)納米流體的研究大多集中在延長(zhǎng)納米顆粒在溶液中的懸浮時(shí)間或改良性狀、提高導(dǎo)熱系數(shù)或減小粘度增強(qiáng)流動(dòng)性等方面，但關(guān)于用在CPU散熱方面的研究卻是很少見到。 本文的研究從對(duì)液體散熱系統(tǒng)的分析和液體散熱工質(zhì)的對(duì)比，從散熱系統(tǒng)（常用液體散熱系統(tǒng)、熱管散熱系統(tǒng)、液體噴射散熱系統(tǒng)）的優(yōu)缺點(diǎn)和各自用途及從冷卻液材料的要求出發(fā)，討論了多種冷卻液材料（水、金屬液體、納米流體）的優(yōu)勢(shì)和不足之處及其實(shí)際效果，并討論了CPU芯片液冷材料需要具備的特點(diǎn)：良好的導(dǎo)熱系數(shù)、流動(dòng)性、高沸點(diǎn)、低冰點(diǎn)、比熱容。除此之外，還必須具備對(duì)人無(wú)毒害、無(wú)刺激，對(duì)環(huán)境友好的特點(diǎn)，具有可持續(xù)發(fā)展性，并依此設(shè)計(jì)了一種以甘油為基，添加純凈水進(jìn)行性狀改良的冷卻液材料，并對(duì)其進(jìn)行實(shí)際測(cè)試，發(fā)現(xiàn)這種冷卻液很好的滿足了散熱要求。 在上述研究結(jié)果的基礎(chǔ)上，本文得出以下結(jié)論： (1)提出了一種廉價(jià)且效果突出的甘油基冷卻液材料，，以水作為溶劑配制成幾組不同濃度的冷卻液，進(jìn)行實(shí)際裝機(jī)測(cè)試并進(jìn)行分析，發(fā)現(xiàn)在對(duì)散熱器的散熱效果受到充液量的限制，當(dāng)充滿冷卻液的散熱效果優(yōu)于裝不滿(96%)的； (2)當(dāng)水作為冷卻液材料時(shí)，大比熱容是讓它在實(shí)際散熱效果中表現(xiàn)不佳的原因，但是較大的比熱容又使它具有緩沖溫度突變的作用，面對(duì)發(fā)熱體突然大量發(fā)熱的情況，水可以使發(fā)熱體的溫度緩慢升高，而不至于溫度突然升高對(duì)發(fā)熱體造成損傷，并隨著冷卻液比熱容的增大，緩沖效果越來(lái)越明顯； (3)冷卻液的比熱容和粘度相互制約，但存在一個(gè)平衡點(diǎn)，使得材料在散熱效果方面表現(xiàn)優(yōu)異，比如甘油25%體積濃度的水溶液，既能保證良好的散熱效果又可以對(duì)溫度突變進(jìn)行緩沖； (4)設(shè)計(jì)了一種新型的雙管道液體散熱器，采用雙管道使得散熱器中可以同時(shí)互不干擾的流動(dòng)兩種性能互補(bǔ)的冷卻液，既可達(dá)到良好的散熱效果，又能夠保留對(duì)溫度突變的緩沖效果。
[Abstract]:Now the heat dissipation problem of the CPU is becoming more and more prominent. With the rapid development of the electronic chip technology, the CPU chip of the computer presents the development trend of high integration, miniaturization and high-frequency, but the CPU chip has a higher calorific value and becomes a key factor in the development of this trend. With the further miniaturization and integration development of the CPU chip, the heat generated by the unit area of the electronic component can be greatly improved, and the heat dissipation efficiency of the heat sink has become an urgent problem, and the advanced electronic chip heat dissipation technology will be the core of solving the problem. The traditional chip heat dissipation technology is challenged, and the air cooling technology is difficult to achieve higher heat dissipation requirements, and the liquid heat dissipation technology with higher heat dissipation effect and development prospect is becoming an important subject of the researchers at home and abroad. The liquid heat dissipation technology is a very effective heat dissipation mode, and it is also very good in the heat dissipation of the CPU The research on the problem of CPU heat dissipation at home and abroad is mainly focused on the design and optimization of liquid radiator, such as the design of heat pipe and micro-channel. In addition, the new type of cooling liquid material which is environment-friendly and less harmful to people is found in the organic solvent to replace the old cooling liquid which pollutes the environment, and the research on the one hand is mainly focused on the relatively strong refrigeration machine of the air conditioner and the refrigerator In addition, the research of the nano-fluid used on the automobile engine is much more, the research on the nano-fluid is mainly focused on the suspension time or the improved character of the nano-particles in the solution, the heat-conducting coefficient or the viscosity-enhancing fluidity, etc. On the other hand, there is little research on the use of heat dissipation in the CPU The research of this paper is from the analysis of the liquid heat dissipation system and the comparison of the liquid heat radiation working medium, and the advantages and disadvantages of the heat dissipation system (the common liquid heat dissipation system, the heat pipe heat dissipation system, the liquid jet heat dissipation system), the respective uses and the cooling liquid materials The advantages and disadvantages of a variety of coolant materials (water, metal liquid, and nano-fluid) and its practical effect are discussed, and the characteristics of the liquid-cooled materials of the CPU chip are discussed. The good thermal conductivity, the fluidity, the high boiling point and the low ice are discussed. In addition, it is necessary to have the characteristics of non-toxic, non-irritating and environment-friendly, and has the characteristics of being environmentally friendly, and has the characteristics of sustainable development, The actual test was performed and it was found that the coolant was well met on the basis of the results of the above-mentioned research, The following conclusions are drawn: (1) A cheap and effective glycerol-based coolant material is proposed, and the water is used as a solvent to prepare several different concentrations of cooling liquid. The actual machine is tested and analyzed, and it is found that the heat dissipation effect on the heat sink is limited by the amount of the charging liquid, and when the heat dissipation effect of the cooling liquid is filled (2) when water is used as a coolant material, the large specific heat capacity is to make it The actual heat dissipation effect is not good, but the larger specific heat capacity makes it have the function of buffer temperature mutation, and the water can cause the temperature of the heating body to rise slowly without the sudden increase of the temperature to the heating body due to the sudden large amount of heat generated by the heating body. Injury, and with the specific heat of the coolant (3) the specific heat capacity and the viscosity of the cooling liquid are mutually restricted, but there is a balance point, so that the material has excellent performance in terms of heat dissipation effect. i. e. an aqueous solution of 25% by volume of glycerol, and (4) a novel double-pipe liquid radiator is designed, The performance is complementary to that of the coolant, which is both good
【學(xué)位授予單位】：陜西科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2013
【分類號(hào)】：TP332

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