本文關(guān)鍵詞：一種新型融合架構(gòu)的SmartRack服務(wù)器系統(tǒng)研究　出處：《山東大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 融合性架構(gòu) 主板 天蝎計(jì)劃 PCB/PCBA 信號(hào)完整性

【摘要】：SmartRack是一種新型融合性架構(gòu)服務(wù)器系統(tǒng),其具有部署密度高、資源配置靈活、管理方便、低耗能等一系列優(yōu)點(diǎn)。受新型融合架構(gòu)的需求影響,電子硬件、機(jī)構(gòu)件、固件及上層軟件上都發(fā)生了一系列革命性改變化,其主要體現(xiàn)在"融合"思想上,在完成軟硬件協(xié)議以后,將傳統(tǒng)的硬件、軟件進(jìn)行解耦融合,使之從傳統(tǒng)的"堆疊"向"有機(jī)融合"深層變革。2009年,互聯(lián)網(wǎng)公司為解決傳統(tǒng)服務(wù)器系統(tǒng)與應(yīng)用發(fā)展需求產(chǎn)生的問題,對(duì)新型融合架構(gòu)服務(wù)器提出初步概念,2012年由BAT(百度、阿里、騰訊)三家互聯(lián)網(wǎng)巨頭牽頭提出融合服務(wù)器架構(gòu),并推出了"天蝎計(jì)劃",對(duì)融合架構(gòu)做了統(tǒng)一規(guī)范,2014年"天蝎計(jì)劃"開始V3.0規(guī)范討論,同年浪潮的SmartRack系統(tǒng)也成功升級(jí)到V4.0,從硬件架構(gòu)到軟件管理都有了更為貼近用戶的改善。浪潮SmartRack系統(tǒng)是跟隨在互聯(lián)網(wǎng)發(fā)展需求變革的道路上產(chǎn)生的,從"天蝎計(jì)劃"開始,浪潮便深度參與其中,為"天蝎計(jì)劃"的發(fā)展起到了積極推動(dòng)作用,也是業(yè)內(nèi)第一家全程參與"天蝎計(jì)劃"的服務(wù)器供貨商,并成為業(yè)內(nèi)融合架構(gòu)服務(wù)器系統(tǒng)及解決方案最主要的廠商,占有業(yè)內(nèi)超過60%的份額,成為百度、阿里巴巴、騰訊、奇虎360、京東、12306的戰(zhàn)略合作伙伴,作為持續(xù)引導(dǎo)行業(yè)融合架構(gòu)發(fā)展方向的主導(dǎo)者之一,SmartRack系統(tǒng)還會(huì)不斷發(fā)展,爭(zhēng)取為各種不同的客戶提供更為高效的服務(wù)。本論文以融合架構(gòu)中的硬件作為研究主體,對(duì)各子系統(tǒng)的硬件部分進(jìn)行分析,完成硬件系統(tǒng)的設(shè)計(jì)研究。本論文的主要研究?jī)?nèi)容有:1.方案采用集中供電、集中散熱解決能耗問題,采用標(biāo)準(zhǔn)接口定義解決各家軟硬件兼容性問題及成本控制問題,采用資源池化解決資源利用率問題,采用集中管理解決管理效率問題。2.將硬件系統(tǒng)進(jìn)行子系統(tǒng)劃分,對(duì)各子系統(tǒng)開展可行性研究分析,對(duì)以主板、電源板、管理板、Expander擴(kuò)展板、硬盤背板、風(fēng)扇板等進(jìn)行接口定義、物理尺寸、邏輯芯片實(shí)現(xiàn)、高速互聯(lián)信號(hào)完整性上進(jìn)行分析,得出最終可行的技術(shù)方案,并對(duì)方案中的風(fēng)險(xiǎn)點(diǎn)進(jìn)行分析和預(yù)防,最終將方案進(jìn)行技術(shù)驗(yàn)證。3.詳細(xì)研究各子邏輯架構(gòu)實(shí)現(xiàn)方案,主要從芯片、連接器等主要部件選擇上進(jìn)行實(shí)現(xiàn)研究,主要包括對(duì):BMC芯片、Redriver芯片、網(wǎng)絡(luò)芯片、VRD芯片、CPLD芯片、Power Connector、高密SSB、銅牌皇冠夾等方面的接口定義、成熟度、廠家配合度、可制造性方面進(jìn)行研究分析。從管理軟件配合上進(jìn)行I2C、GPI0等功能接口定義實(shí)現(xiàn)進(jìn)行分析。4.研究各子系統(tǒng)PCB物理實(shí)現(xiàn)方案,研究物理互聯(lián)的最佳實(shí)現(xiàn)方式,研究各主要器件及部件的物理空間擺放,研究各互聯(lián)板卡的PCB材料選擇包括DK、DF、CAF、TG、TD參數(shù)選取,研究各互聯(lián)線路特別是高速信號(hào)如PCIE、QPI、LAN、SAS/SATA、USB、Clock 以及敏感信號(hào)如 SVID、SPI、PECI、LPC、I2C 等信號(hào)在PCB板上走線的方式,分析如何使降低Crosstalk、Insertion Loss等。5.從信號(hào)仿真對(duì)系統(tǒng)高速互聯(lián)進(jìn)行研究,對(duì)所有互聯(lián)Bus進(jìn)行全鏈路梳理,針對(duì)風(fēng)險(xiǎn)較高鏈路,開展模型提取,鏈路搭接,仿真分析研究,對(duì)無法滿足SPEC要求的鏈路進(jìn)行應(yīng)對(duì)措施研究,保證各多級(jí)互聯(lián)線路的信號(hào)完整性。6.對(duì)制造完成的板卡進(jìn)行信號(hào)測(cè)量分析研究,利用TDR、VNA、高速示波器以及相關(guān)測(cè)量治具對(duì)各主要高速鏈路開展信號(hào)測(cè)量,并分析信號(hào)測(cè)量數(shù)據(jù)的問題點(diǎn)及優(yōu)化方向,與仿真數(shù)據(jù)數(shù)據(jù)進(jìn)行對(duì)比,優(yōu)化仿真模型。本論文的主要?jiǎng)?chuàng)新點(diǎn)如下:1.首次實(shí)現(xiàn)了整機(jī)柜中各類節(jié)點(diǎn)(計(jì)算、存儲(chǔ)等、網(wǎng)絡(luò)等)靈活互換,實(shí)現(xiàn)數(shù)據(jù)機(jī)房的資源池化整合,通過高速網(wǎng)絡(luò)互聯(lián)實(shí)現(xiàn)數(shù)據(jù)機(jī)房的計(jì)算單元、存儲(chǔ)單元、網(wǎng)絡(luò)單元解耦整合,利用軟件實(shí)現(xiàn)虛擬資源池,實(shí)現(xiàn)軟件定義計(jì)算,軟件定義存儲(chǔ),軟件定義網(wǎng)絡(luò),依據(jù)上層需求實(shí)現(xiàn)資源動(dòng)態(tài)分配,從而得到最大資源利用效率。2.首次實(shí)現(xiàn)各子節(jié)點(diǎn)集中管理,通過I2C總線將各子節(jié)點(diǎn)集中鏈接到管理中板的BMC管理芯片上,通過BMC對(duì)外的1000M網(wǎng)絡(luò),實(shí)現(xiàn)各子節(jié)點(diǎn)的電壓、電流、溫度、開關(guān)機(jī)等功能;在減少獨(dú)立管理所需的軟硬件資源外,大大提升了管理效率。3.首次實(shí)現(xiàn)整機(jī)柜集中供電,采用Power Supply前維護(hù)方式,在機(jī)柜中間設(shè)計(jì)獨(dú)立的Power Supply供電盒,采用N+N冗余方式供電,220V交流輸入通過Power Supply轉(zhuǎn)換成12V直流,傳導(dǎo)進(jìn)入自上而下的兩根銅牌上,各節(jié)點(diǎn)通過皇冠夾統(tǒng)一從銅牌上取電。集中供電降低了分散式供電的損耗,提升了供電效率。4.采取了集中散熱模式,首次使用了風(fēng)扇墻設(shè)計(jì),通過偵測(cè)三組節(jié)點(diǎn)溫度來調(diào)控風(fēng)扇轉(zhuǎn)速,采用大功率風(fēng)扇替代分散式小型風(fēng)扇,大大降低了風(fēng)扇數(shù)量,減少了單體風(fēng)扇損耗的,風(fēng)扇效率提升了 25%,同時(shí)降低了系統(tǒng)噪聲。5.新型融合架構(gòu)服務(wù)器密度較傳統(tǒng)服務(wù)器部署密度提升了 20%,由于各系統(tǒng)遵循的協(xié)議相同,不同廠商的機(jī)器可以相互兼容,部署效率也得到大幅提升。
[Abstract]:SmartRack is a new integration architecture server system, which has high deployment density, flexible allocation of resources, convenient management, a series of advantages of low power consumption. The demand impact by the new fusion architecture of electronic hardware components, firmware and software have undergone a series of revolutionary changes, which is mainly embodied in the "on the thought of integration of hardware and software, in the protocol, the traditional hardware and software are decoupled fusion, from the traditional" stack "to" organic integration "deep changes in.2009 years, the Internet Co in order to solve the traditional server system and application development needs of the cause of the problem, put forward the preliminary concept of the new fusion architecture server, 2012 by the BAT (Baidu, Ali, Tencent) three Internet giants led the proposed fusion server architecture, and introduced the" Scorpio plan "to fusion the architecture of unified standard, 2014 Scorpio plan to start V 3 specification is discussed, the same year the wave of SmartRack system has successfully upgraded to V4.0, from hardware to software management is more close to the user's SmartRack system is improved. The tide of follow the development demand change on the Internet on the road, starting from the "Scorpio", then the wave depth involved, to actively role as "Scorpio development plan", is the first in the industry to participate in the "Scorpio plan" server suppliers, and become the fusion architecture of server system and vendor solutions the main industry, occupy more than 60% share, become Baidu, Alibaba, Tencent, Qihoo 360, Jingdong, 12306 strategic partner. As one of the leading industry continues to lead the development direction of the integration of architecture, the SmartRack system will continue to develop for different customers to provide more efficient services. In this paper The hardware integration architecture as the research subject, the hardware subsystem analysis, completes the design of hardware system research. The main contents of this paper are: 1. the scheme adopts the centralized power supply, centralized heat to solve the problem of energy consumption, using the standard interface definition to solve various hardware and software compatibility issues and cost control problem, using resources to solve the problem of pool resource utilization, centralized management of.2. will solve the problem of efficiency management system hardware subsystem, analysis of feasibility study of each subsystem, on board, power board, control board, Expander expansion board, hard board, backplane, fan interface definition, physical size, logic chip. Analysis of signal integrity of high-speed Internet, obtain the final feasible technical scheme, and the scheme of the risk analysis and prevention, will conduct technical inspection .3. permits a detailed study of the various sub logic program, mainly from the chip, connectors and other main components selection on the achievement of research, mainly including: BMC chip, Redriver chip, network chip, VRD chip, CPLD chip, Power Connector, SSB density, interface definition, and other aspects of the bronze crown clip maturity, with manufacturers of manufacturing are studied and analyzed. From I2C management software with GPI0 function, interface definition realization.4. analysis subsystem PCB physical implementation, the best method of physical interconnection, physical space research of the major components and parts of the display, PCB materials research of all Internet card selection including DK, DF, CAF, TG, TD parameter selection, the study of interconnection lines especially high speed signals such as PCIE, QPI, LAN, SAS/SATA, USB, Clock and SPI, sensitive signals such as SVID, PECI, LPC, I2C signal on the PCB board. Walk the line, analyze how to reduce Crosstalk, Insertion Loss and.5. to study the system of high speed interconnection from signal simulation, full link to sort out all Internet Bus, according to the risk of high link, carry out model extraction, link lap, simulation study and Analysis on Countermeasures to meet the requirements of the SPEC method without link ensure that the multistage interconnection line, the signal integrity of.6. fabricated board were studied, analysis of the signal measured by TDR, VNA, high speed oscilloscope and related measurement tool to carry out signal measurement of the main high-speed link, and signal analysis of measurement data problems and optimization direction, compared with the simulation data, the optimization simulation model. The main innovations of this dissertation are as follows: 1. for the first time the whole cabinet in various types of nodes (computing, storage, network etc.) flexible data exchange, resource pool room Through the integration, computing unit, high-speed network data storage room unit, network unit decoupling integration, virtual resource pool using the software, software defined computing, software defined storage, software defined network, based on the upper needs to achieve dynamic resource allocation, to maximize the resource utilization efficiency of.2. for the first time in each sub node centralized management through the I2C bus, the sub nodes link to the BMC management chip management board, through BMC's 1000M network, realize the sub node voltage, current, temperature, switches and other functions; in the software and hardware resources required to reduce the independent management, greatly enhance the management efficiency of the whole.3. for the first time the cabinet centralized power supply, using Power Supply Power Supply in maintenance mode, power supply box cabinet intermediate design independently, powered by N+N redundancy mode, 220V AC input by Power Suppl Convert y to 12V DC, two bronze into conduction from top to bottom, each node through the crown to take power from the bronze clip unified. The centralized power supply reduces the loss of distributed power supply, improve the efficiency of power supply.4. adopted centralized heat model, the first use of the fan wall design, to control the rotation speed of the fan through the detection of three groups of nodes temperature, using high-power fan instead of distributed small fan, greatly reducing the number of fans, reduce the loss of the fan, the fan efficiency by 25%, while reducing the noise of the.5. model system integration architecture than the traditional density server server deployment density increased by 20%, because the system follows the protocol, different manufacturers of machines can be compatible with each other, the deployment efficiency has been greatly improved.

【學(xué)位授予單位】：山東大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TP368.5

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1 王林;一種新型融合架構(gòu)的SmartRack服務(wù)器系統(tǒng)研究[D];山東大學(xué);2017年

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本文編號(hào)：1434406