采用真空擴散焊接方法對Q235A低碳鋼與AISI304奧氏體不銹鋼進行固相擴散連接實驗,研究了焊接溫度對接頭界面組織、力學性能和反應(yīng)產(chǎn)物的影響。結(jié)果表明:Q235A低碳鋼/AISI304奧氏體不銹鋼復合界面附近形成了合金鐵素體層（Ⅱ區(qū)）和增C層（Ⅲ區(qū)）,界面兩側(cè)異相組織通過擴散結(jié)成共用晶界。在焊接溫度850℃,焊接壓力10 MPa,焊接時間60 min條件下,接頭強度和韌性達到最大值,高于Q235A低碳鋼母材。焊接溫度過低（≤800℃）,接頭中析出碳化物Cr₂₃C₆,焊接溫度過高（≥900℃）,接頭中會產(chǎn)生二次碳化物和金屬間化合物,脆性的化合物偏析相使接頭強韌性顯著下降。嚴格控制焊接溫度在850℃區(qū)間,并在焊后迅速淬火越過低溫區(qū),可有效避免脆性化合物偏析,從而保證擴散焊接頭的性能。 

【文章頁數(shù)】：8 頁

【文章目錄】：
1 實驗方法
2 實驗結(jié)果和分析
    2.1 接頭宏觀結(jié)構(gòu)
    2.2 接頭微觀結(jié)構(gòu)
    2.3 界面元素分布
    2.4 接頭力學性能
        2.4.1 顯微硬度
        2.4.2 抗拉強度
        2.4.3 沖擊韌性和斷裂特征
3 結(jié)論


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