Cu/Al復合帶固-液鑄軋復合界面演化(英文)
發(fā)布時間:2022-08-23 14:48
利用固-液鑄軋復合(簡稱SLCRB)技術,在d160 mm×150 mm二輥實驗鑄軋機上制備Cu/Al復合帶,并對其界面擴散層的反應程度、反應產(chǎn)物組成及顯微組織演變規(guī)律進行SEM、EDS和XRD分析。結(jié)果表明,鑄軋液相熔池內(nèi),液態(tài)鋁液與銅帶接觸后在其表面形成初始滲鋁層,界面成分主要為α(Al)+Cu Al2,且擴散層厚度在高溫下逐漸生長變厚,最厚處約為10μm;進入低于kiss點的固相區(qū)后,擴散層在劇烈軋制延伸變形作用下破裂,界面兩側(cè)原始基材被擠出接觸后形成新的復合界面,在鑄軋出口處形成沿軋制方向彌散分布的CuAl2、CuAl和Cu9Al4,擴散層平均厚度由10μm減薄至5μm且較為均勻。剝離和折彎性能測試結(jié)果表明,所制備的Cu/Al復合帶剝離斷裂面出現(xiàn)在Al基體側(cè),斷口呈顯著韌性斷裂,試件經(jīng)90°~180°折彎后未出現(xiàn)界面撕裂現(xiàn)象。研究成果為高效短流程制備Cu/Al復合帶提供了工藝基礎。
【文章頁數(shù)】:7 頁
【文章目錄】:
1 Introduction
2 Experimental
3 Results and discussion
3.1 Overview of cast-rolling bonding area
3.2 Micro-morphology of bonding interface
3.3 Peeling test of Cu/Al clad strip
3.4 Bending test of Cu/Al clad strip
3.5 Bonding mechanism of SLCRB process
4 Conclusions
【參考文獻】:
期刊論文
[1]充芯連鑄銅包鋁復合材料的界面形成機理[J]. 張建宇,曾祥勇,韓艷秋,姚金金,吳春京. 中國有色金屬學報. 2014(11)
[2]銅包鋁復合材料研究進展[J]. 張建宇,姚金金,曾祥勇,韓艷秋,吳春京. 中國有色金屬學報. 2014(05)
[3]銅鋁雙金屬復合材料的研究進展[J]. 劉騰,劉平,王渠東. 材料導報. 2013(19)
[4]Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al[J]. B. Xu1), W.P. Tong1), C.Z. Liu2), H. Zhang1), L. Zuo1) and J.C. He1) 1) Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials, Northeastern University, Shenyang 110004, China 2) Department of Materials Engineering, Shenyang Institute of Aeronautical Engineering, Shenyang 110034, China. Journal of Materials Science & Technology. 2011(09)
[5]銅/鋁復合材料的固-液復合法制備及其界面結(jié)合機理[J]. 張紅安,陳剛. 中國有色金屬學報. 2008(03)
本文編號:3677961
【文章頁數(shù)】:7 頁
【文章目錄】:
1 Introduction
2 Experimental
3 Results and discussion
3.1 Overview of cast-rolling bonding area
3.2 Micro-morphology of bonding interface
3.3 Peeling test of Cu/Al clad strip
3.4 Bending test of Cu/Al clad strip
3.5 Bonding mechanism of SLCRB process
4 Conclusions
【參考文獻】:
期刊論文
[1]充芯連鑄銅包鋁復合材料的界面形成機理[J]. 張建宇,曾祥勇,韓艷秋,姚金金,吳春京. 中國有色金屬學報. 2014(11)
[2]銅包鋁復合材料研究進展[J]. 張建宇,姚金金,曾祥勇,韓艷秋,吳春京. 中國有色金屬學報. 2014(05)
[3]銅鋁雙金屬復合材料的研究進展[J]. 劉騰,劉平,王渠東. 材料導報. 2013(19)
[4]Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al[J]. B. Xu1), W.P. Tong1), C.Z. Liu2), H. Zhang1), L. Zuo1) and J.C. He1) 1) Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials, Northeastern University, Shenyang 110004, China 2) Department of Materials Engineering, Shenyang Institute of Aeronautical Engineering, Shenyang 110034, China. Journal of Materials Science & Technology. 2011(09)
[5]銅/鋁復合材料的固-液復合法制備及其界面結(jié)合機理[J]. 張紅安,陳剛. 中國有色金屬學報. 2008(03)
本文編號:3677961
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