發(fā)布時間：2020-12-07 15:05

　　增材制造,又稱3D打印技術(shù),深刻地改變了零部件成型方式。本文對比了兩種工藝EBM和SLM焊接Ti-6Al-4V合金,并詳細研究了其對材料微觀結(jié)構(gòu)和力學(xué)性能的影響。另外,本文還討論了兩種熱處理對材料特性的影響:熱均壓法（HIP）和退火。同時使用了電子背散射衍射（EBSD）和X射線衍射對材料的微觀結(jié)構(gòu)進行表征,結(jié)果顯示EBM帶來了α層片中β殘留,而SLM產(chǎn)生了馬氏體α’結(jié)構(gòu)。熱處理都使得材料的剛度和韌性得到提升。EBM樣本HIP處理后極限拉伸強度（UTS）提升了21%。然而SLM樣本退火后極限拉伸強度下降了20%,這主要由于從馬氏體α’轉(zhuǎn)變?yōu)閘amellarα+β帶來的微觀結(jié)構(gòu)的改變。 

【文章來源】：上海交通大學(xué)上海市 211工程院校 985工程院校 教育部直屬院校

【文章頁數(shù)】：62 頁

【學(xué)位級別】：碩士

【文章目錄】：
Abstract
摘要
1.Introduction
    1.1.Introduction to Additive Manufacturing
        1.1.1.Electron Beam Melting
        1.1.2.Selective Laser Melting
    1.2.Ti-6Al-4V:Interesting Properties for Additive Manufacturing
2.Experiments
    2.1.EBSD:Method and Protocol
        2.1.1.Introduction to EBSD
        2.1.2.Experimental Protocol and Parameters
        2.1.3.EBSD Data analysis with OIM 7
    2.2.X-Ray Diffraction:Method and Protocol
        2.2.1.Introduction to Synchrotron Radiation
        2.2.2.Experimental Protocol and Parameters
        2.2.3.XRD data Treatment:From a2D Pattern to a peaks identification
3.Results and Discussion
    3.1.Identification of the Microstructure
        3.1.1.Microscopy:Picturing the phases with grain maps
        3.1.2.XRD Identification of the different phases
        3.1.3.Discussion about the Microstructure: α, α’andβ peaks
    3.2.Analysis of the mechanical properties
        3.2.1.Adapting the Data Spreading
        3.2.2.Analysis of the Ductility
        3.2.3.Analysis of the Stiffness:Young’s Modulus calculation
        3.2.4.Tensile properties:UTS and Fracture Stress
Conclusion
Acknowledgements
Appendix
    Control Sample Data
    Fit2D Analysis Parameters
    Initial State2D Pattern from XRD
    OIM Grain Size Analysis
    XRD data:Calculation of the Young Modulus,Poisson ratio
    XRD Data:Intensity for each identified Diffracted Peaks
References



本文編號：2903467