【摘要】：針對糊狀釬劑在釬料表面難以均勻潤濕鋪展的問題,采用金相顯微鏡、潤濕角測定儀、表面張力儀等分析設(shè)備,對不同濃度糊狀釬劑在釬料表面的黏附行為進行研究。結(jié)果表明:糊狀釬劑的黏附層隨濃度的增大而逐漸增厚,薄黏附層發(fā)生少量收縮現(xiàn)象,厚黏附層發(fā)生大量下滑脫落及收縮現(xiàn)象。對于理想表面,不同濃度糊狀釬劑的黏附張力相同。對于實際表面,表面條紋槽對糊狀釬劑具有附加壓力作用,附加壓力是黏附層收縮發(fā)生滯后現(xiàn)象的主要原因。隨著糊狀釬劑濃度的增大,附加壓力和滯后阻力減小,收縮加劇。薄黏附層收縮需滿足:ΔWC≥A+ΔP,即收縮現(xiàn)象發(fā)生與否主要取決于黏附張力和附加壓力。
[Abstract]:In order to solve the problem that the paste flux is difficult to spread uniformly on the surface of solder, the adhesion behavior of different concentration paste flux on the surface of solder is studied by means of metallographic microscope, wetting angle tester and surface tension meter. The results show that the adhesive layer of the paste flux increases gradually with the increase of the concentration, a small amount of shrinkage occurs in the thin adhesive layer, and a large number of slippage and shrinkage occur in the thick adhesive layer. For ideal surfaces, the adhesive tension of different concentrations of paste flux is the same. For the actual surface, the surface stripe groove has the additional pressure on the paste flux, and the additional pressure is the main reason for the hysteresis of the adhesion layer shrinkage. With the increase of the paste flux concentration, the additional pressure and hysteresis resistance decrease, and the shrinkage intensifies. The shrinkage of the thin adhesive layer should be satisfied: 螖 WC 鈮，

本文編號：2222138