【摘要】：鈹銅合金性能優(yōu)異,但潛存毒性危害,Cu-Ni-Sn合金是一種典型的調(diào)幅分解強化型彈性銅合金,憑借其高的強度、硬度、彈性和優(yōu)良的抗應力松弛性能,廣泛應用于電子、航天、航海等領域,是替代鈹銅的候選材料之一。然而Cu-Ni-Sn合金體系復雜,不同成分合金的性能差異較大,傳統(tǒng)的研究材料的方法,一次只能研究一種或幾種成分的合金,因此本文選擇了"擴散多元節(jié)"高通量實驗方法對Cu-Ni-Sn合金進行研究。本文采用CALPHAD相圖計算手段,計算了Cu,Ni和Sn元素在相變過程中的活度變化曲線,根據(jù)元素活度在合金相中的范圍大小對Cu-Ni-Sn三元擴散偶的Cu-Ni,Cu-Cu35Sn和Ni-Cu35Sn各個界面的固相序列進行了理論優(yōu)化。通過Cu-Ni-Sn三元擴散偶實驗,獲得了CuNi,Cu-Cu35Sn和Ni-Cu35Sn擴散界面的過渡層組織形貌,結(jié)合理論計算結(jié)果,得到了可能的界面固相序列。在650℃條件下,Cu-Ni界面處僅有fcc_A1相的過渡層;Cu-Cu35Sn界面過渡層固相序列自富Cu端為fcc_A1→D03_Cu3Sn/Cu3Sn;Ni-Cu35Sn界面的固相序列自富Ni端為fcc_A1+Ni3Sn_LT→fcc_A1+Ni3Sn2→Ni3Sn2+D03_Cu3Sn/Cu3Sn。
[Abstract]:Beryllium copper alloy has excellent properties, but the latent toxicity of Cu-Ni-Sn alloy is a typical elastic copper alloy strengthened by amplitude modulation decomposition. Due to its high strength, hardness, elasticity and excellent stress relaxation resistance, Cu-Ni-Sn alloy has been widely used in electronics and spaceflight. Navigation is one of the candidate materials to replace beryllium copper. However, the Cu-Ni-Sn alloy system is complex, and the properties of different composition alloys vary greatly. The traditional method of studying materials can only study one or more alloys with one or more components at a time. In this paper, the high-throughput Cu-Ni-Sn alloy was studied by means of diffusion multicomponent node. In this paper, the activity curves of Cu,Ni and Sn elements during phase transition are calculated by means of CALPHAD phase diagram. The solid sequences of Cu-Ni,Cu-Cu35Sn and Ni-Cu35Sn interfaces of Cu-Ni-Sn ternary diffusion couple were optimized theoretically according to the range of element activity in the alloy phase. The morphology of transition layer of CuNi,Cu-Cu35Sn and Ni-Cu35Sn diffusion interface was obtained by Cu-Ni-Sn diffusion couple experiment. Combined with the theoretical results, the possible interfacial solid sequence was obtained. At 650 鈩，

本文編號：2219172