本文選題：銅錳合金 + 濺射靶材　； 參考：《稀有金屬》2017年02期

【摘要】：當(dāng)前超大規(guī)模集成電路(ULSI)的特征尺寸已經(jīng)步入納米范圍,隨著特征尺寸的減小,銅互連面臨著嚴(yán)重的可靠性問(wèn)題,采用合金化手段可有效抑制晶界附近的電遷移。因而本文主要研究超高純銅錳合金材料,通過(guò)金相(OM)、電子背散射衍射(EBSD)等分析手段研究超高純銅錳合金材料塑性形變過(guò)程和熱處理過(guò)程中銅錳合金試樣的微觀組織變化和軋制、再結(jié)晶織構(gòu)變化。實(shí)驗(yàn)結(jié)果表明:經(jīng)過(guò)對(duì)塑性變形試樣的分析后發(fā)現(xiàn),試樣微觀組織主要由許多破碎的小晶粒及亞晶組成,同時(shí)試樣中存在典型的軋制織構(gòu)并且存在大量的小角度晶界。經(jīng)過(guò)退火熱處理后,試樣的微觀組織比較均勻,晶粒細(xì)小,晶粒尺寸大約為10.7μm;典型軋制織構(gòu)組分下降比較明顯,典型再結(jié)晶織構(gòu)組分上升,但大部分晶粒處于隨機(jī)取向,試樣退火熱處理后幾乎全部為大角度晶界。
[Abstract]:At present, the characteristic size of ULSI has stepped into the nanometer range. With the reduction of characteristic size, copper interconnection faces serious reliability problems. The electromigration near grain boundaries can be effectively restrained by alloying. In this paper, the microstructure changes and rolling of ultrapure Cu-Mn alloy samples during plastic deformation and heat treatment are studied by means of metallography (OM) and electron backscatter diffraction (EBSD). Recrystallization texture change. The experimental results show that the microstructure of the specimens is mainly composed of many broken small grains and sub-grains, and there are typical rolling texture and a large number of small angle grain boundaries. After annealing and heat treatment, the microstructure of the sample is more uniform, the grain size is about 10.7 渭 m, the typical rolling texture component decreases more obviously, the typical recrystallization texture component increases, but most of the grains are randomly oriented. Almost all samples are large angle grain boundaries after annealing and heat treatment.
【作者單位】： 北京有色金屬研究總院有研億金新材料有限公司北京市高純金屬濺射靶材工程技術(shù)研究中心;
【基金】：北京市科技新星項(xiàng)目(Z1511000003150102)資助
【分類號(hào)】：TN405.97;TG146.11

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