本文選題：Sn-Bi-In + 顯微組織�。� 參考：《稀有金屬材料與工程》2017年10期

【摘要】：研究了Sn-Bi-In釬料的微觀組織、熱學(xué)特性、潤濕性能以及力學(xué)性能隨合金成分的變化特點。結(jié)果表明:Sn-Bi-In釬料的顯微組織含有β-Sn相、Bi相以及InBi中間相,Bi含量的減少會導(dǎo)致Bi相和InBi相所占比例降低;釬料DSC曲線中存在3個不同大小的吸熱峰,所有合金熔化開始溫度在101.3~103.4℃之間,隨著Sn含量的增加,釬料的熔程先減小后增大,鋪展面積先增大后減小;釬料的顯微硬度隨著Bi含量的增加而增大,且In的添加使釬料的硬度明顯高于Sn-Bi共晶合金;釬料的抗拉強度和斷后伸長率隨著Bi含量的增大而降低。
[Abstract]:The microstructure, thermal properties, wettability and mechanical properties of Sn-Bi-In solder were studied. The results show that the proportion of Bi phase and InBi phase decreases due to the decrease of the content of 尾 -Sn phase and InBi phase in the microstructure of the filler metal, and there are three endothermic peaks in the DSC curve of the solder. With the increase of Sn content, the melting range of the solder decreases first and then increases, the spreading area increases first and then decreases, and the microhardness increases with the increase of Bi content, and the melting start temperature of all alloys is between 101.3 鈩，

本文編號：2076721