本文選題：納晶銅 + 熱導(dǎo)率��； 參考：《物理學(xué)報(bào)》2016年10期

【摘要】：用熱壓燒結(jié)法制備得到納晶銅塊體.用激光法測(cè)定了不同溫度下制備得到的納晶銅塊體的熱導(dǎo)率,并建立卡皮查熱阻模型對(duì)樣品熱導(dǎo)率進(jìn)行模擬.通過(guò)對(duì)比,模擬結(jié)果與實(shí)驗(yàn)數(shù)據(jù)基本一致.隨著熱壓燒結(jié)溫度的升高,納晶銅晶粒尺寸也隨之增大.在900和700?C其熱導(dǎo)率分別達(dá)到了最大和最小值且所對(duì)應(yīng)的熱導(dǎo)率分別為200.63和233.37 W·m~(-1)·K~(-1),各占粗晶銅塊體熱導(dǎo)率的53.4%和60.6%.驗(yàn)證了納晶銅熱導(dǎo)率在一定的晶粒尺寸范圍內(nèi)具有尺寸效應(yīng),隨著晶粒尺寸的減小,熱導(dǎo)率逐漸減小.
[Abstract]:Nanocrystalline copper blocks were prepared by hot pressing sintering. The thermal conductivity of nanocrystalline copper bulk prepared at different temperatures was measured by laser method, and the thermal conductivity of the sample was simulated by using the Kapicha thermal resistance model. By comparison, the simulation results are basically consistent with the experimental data. The grain size of nanocrystalline copper increases with the increase of hot pressing sintering temperature. The maximum and minimum thermal conductivities are obtained at 900 and 700 鈩，

本文編號(hào)：1946229