發(fā)布時間：2018-05-28 09:45

  本文選題：納晶銅 + 熱導率��； 參考：《物理學報》2016年10期

【摘要】：用熱壓燒結法制備得到納晶銅塊體.用激光法測定了不同溫度下制備得到的納晶銅塊體的熱導率,并建立卡皮查熱阻模型對樣品熱導率進行模擬.通過對比,模擬結果與實驗數(shù)據(jù)基本一致.隨著熱壓燒結溫度的升高,納晶銅晶粒尺寸也隨之增大.在900和700?C其熱導率分別達到了最大和最小值且所對應的熱導率分別為200.63和233.37 W·m~(-1)·K~(-1),各占粗晶銅塊體熱導率的53.4%和60.6%.驗證了納晶銅熱導率在一定的晶粒尺寸范圍內(nèi)具有尺寸效應,隨著晶粒尺寸的減小,熱導率逐漸減小.
[Abstract]:Nanocrystalline copper blocks were prepared by hot pressing sintering. The thermal conductivity of nanocrystalline copper bulk prepared at different temperatures was measured by laser method, and the thermal conductivity of the sample was simulated by using the Kapicha thermal resistance model. By comparison, the simulation results are basically consistent with the experimental data. The grain size of nanocrystalline copper increases with the increase of hot pressing sintering temperature. The maximum and minimum thermal conductivities are obtained at 900 and 700 鈩，

本文編號：1946229