本文選題：Cu-Ag合金 + 顯微組織　； 參考：《稀有金屬材料與工程》2017年09期

【摘要】：采用冷軋和時(shí)效工藝制備了Cu-24%Ag(質(zhì)量分?jǐn)?shù))合金板材,研究了軋制過(guò)程中合金組織與性能的演變規(guī)律,討論了合金強(qiáng)化和電導(dǎo)率與組織變化的關(guān)系。劇烈的軋制變形后,合金組織演變成Cu基體和Ag相交替排列的納米層狀結(jié)構(gòu),Cu基體中包含大量細(xì)小的Ag析出相纖維,一些Ag層區(qū)域分布著(Cu+Ag)共晶體。當(dāng)變形至94%左右時(shí),縱截面組織出現(xiàn)剪切帶。隨變形量增大,Cu基體和Ag層之間的相界面間距、Ag析出相纖維間距和共晶體片層間距均逐漸減小至幾十納米,強(qiáng)化效應(yīng)顯著增強(qiáng),使合金的硬度在變形量大于96%時(shí)急劇增大。建立了Cu/Ag界面引起的電阻率增幅與變形量的關(guān)系,可以反映軋制變形引起的組織細(xì)化對(duì)合金電導(dǎo)率的影響規(guī)律。
[Abstract]:Cu-24 Ag-based alloy sheet was prepared by cold rolling and aging process. The evolution of microstructure and properties during rolling was studied, and the relationship between alloy strengthening, electrical conductivity and microstructure was discussed. After severe rolling deformation, the microstructure of the alloy evolved into Cu matrix and Ag phase alternately arranged nanoscale structure Cu matrix containing a large number of fine Ag precipitated phase fibers, and some Ag layers were distributed in Cu Ag eutectic. When the deformation is about 94%, the shear band appears in the longitudinal section. With the increase of deformation amount, the interphase spacing between Cu matrix and Ag layer decreases gradually to dozens of nanometers, and the hardness of the alloy increases sharply when the deformation amount is greater than 96. The relationship between the increase of resistivity caused by Cu/Ag interface and the amount of deformation is established, which can reflect the effect of microstructure refinement caused by rolling deformation on the electrical conductivity of the alloy.
【作者單位】： 北京有色金屬研究總院;
【基金】：國(guó)家自然科學(xué)基金(51401026)
【分類(lèi)號(hào)】：TG146.11

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1 楊陽(yáng);Ag合金化鎂合金的第一性原理計(jì)算[D];沈陽(yáng)工業(yè)大學(xué);2017年

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本文編號(hào)：1876095