本文選題：Ni-Cu異種金屬材料 + 低溫TLP擴(kuò)散連接��； 參考：《焊接學(xué)報(bào)》2017年10期

【摘要】：采用厚度40μm的純錫釬料中間層在鎳和銅基板間實(shí)現(xiàn)了低溫瞬態(tài)液相擴(kuò)散連接(transient liquid phase bonding,TLP Bonding),通過延長等溫反應(yīng)時(shí)間,獲得了完全由(Cu,Ni)6Sn5和Cu3Sn兩種金屬間化合物相(intermetallic compounds,IMCs)組成的焊接接頭.在Ni-Cu TLP擴(kuò)散連接液-固反應(yīng)過程中,Sn/Ni和Sn/Cu界面處均形成了(Cu,Ni)6Sn5,但晶粒形貌存在差異,從鎳側(cè)到銅側(cè)化合物形貌依次是小顆粒狀、針狀和扇貝狀.此外,Cu3Sn的生長受到了抑制.該IMCs接頭具有418.4℃的重熔溫度和49.8 MPa的平均抗剪強(qiáng)度,能夠滿足高溫功率器件封裝中對(duì)耐高溫互連的需求,并且有助于提高電子器件在惡劣條件下服役時(shí)的可靠性.
[Abstract]:Transient liquid phase bonding and TLP bonding between nickel and copper substrates were realized by using 40 渭 m thickness pure tin filler metal interlayer. By prolonging the isothermal reaction time, a welding joint composed of intermetallic metal compoundsIMCsof two kinds of intermetallic compounds, CuCuPNiNi6Sn5 and Cu3Sn, was obtained by prolonging the isothermal reaction time. In the process of liquid-solid reaction of Ni-Cu TLP diffusion bonding, Ni-Cu TLP / Ni / Ni and Sn/Cu interface were formed, but the grain morphology was different, from nickel side to copper side, the morphologies of compounds were small granular, acicular and scallop. In addition, the growth of Cu3Sn was inhibited. The IMCs joint has a remelting temperature of 418.4 鈩，

本文編號(hào)：1844581