本文選題：Ti(C + N)基金屬陶瓷��； 參考：《南京航空航天大學(xué)》2016年碩士論文

【摘要】：本文采用銅基釬料,實(shí)現(xiàn)Ti(C,N)基金屬陶瓷和Mo2FeB2基金屬陶瓷與45鋼的真空釬焊連接,研究了釬焊工藝參數(shù)對(duì)接頭的剪切強(qiáng)度的影響規(guī)律,并采用X射線衍射(XRD)、掃描電子顯微鏡(SEM)、能譜分析儀(EDS)等實(shí)驗(yàn)分析手段研究了Ti(C,N)基金屬陶瓷/銅基釬料/45鋼、Mo2FeB2基金屬陶瓷/銅基釬料/45鋼釬焊接頭的界面產(chǎn)物和顯微組織形貌以及元素分布。本文首先綜述了金屬陶瓷的研究進(jìn)展及其應(yīng)用前景和近二十年金屬陶瓷與鋼連接技術(shù)的研究進(jìn)展,并介紹了各種連接技術(shù)優(yōu)缺點(diǎn),同時(shí)介紹常用釬料的性能與優(yōu)缺點(diǎn),在此基礎(chǔ)上提出本文的研究目的和意義。采用自制銅基釬料,真空釬焊連接Ti(C,N)基金屬陶瓷與鋼,研究了主要工藝參數(shù)對(duì)接頭剪切強(qiáng)度和顯微組織的影響規(guī)律。最優(yōu)工藝參數(shù)為1060℃和10min,此時(shí),接頭剪切強(qiáng)度達(dá)到195.3MPa,同時(shí),在釬料與母材界面處形成一定厚度的擴(kuò)散層,其中主要物相為(Cu,Ni)固溶體和(Fe,Ni)固溶體。首次研究Mo2FeB2基金屬陶瓷與45鋼的真空釬焊連接,結(jié)果發(fā)現(xiàn),釬焊溫度和保溫時(shí)間對(duì)接頭剪切強(qiáng)度的影響呈現(xiàn)拋物線型,在工藝參數(shù)為1020℃和20min時(shí)接頭剪切強(qiáng)度達(dá)到240.5MPa,金屬陶瓷粘結(jié)相向釬料層擴(kuò)散,抑制釬料中元素?cái)U(kuò)散,并且降低金屬陶瓷近釬料一側(cè)的強(qiáng)度,是導(dǎo)致接頭剪切強(qiáng)度下降的原因之一。在自制銅基釬料的基礎(chǔ)上,開發(fā)出多元合金銅基釬料,采用多元合金銅基釬料真空釬焊連接金屬陶瓷與45鋼,Ti(C,N)基金屬陶瓷和Mo2FeB2基金屬陶瓷與45鋼的釬焊接頭剪切強(qiáng)度分別提高到270.4MPa和275.7MPa,最優(yōu)釬焊溫度相應(yīng)提高20℃。調(diào)整銅基釬料合金元素含量后,銅基釬料與兩側(cè)母材的元素?cái)U(kuò)散增強(qiáng),釬焊接頭剪切強(qiáng)度和使用溫度提高,最后探索了金屬陶瓷與鋼的釬焊連接機(jī)理。
[Abstract]:In this paper, the vacuum brazing of TiCn-based cermet and Mo2FeB2 base cermet with 45 steel is realized by using copper based solder. The influence of brazing process parameters on the shear strength of the joint is studied. The interfacial products and the display of TiCn-based cermet / copper-base brazing metal / 45 steel / Mo2FeB2 cermet / copper-base brazing joint were studied by means of X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive analyzer (EDS), and the interfacial products of the brazed joints were studied by means of X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive analysis (EDS). The morphology of microstructures and the distribution of elements. In this paper, the research progress and application prospect of cermet and the research progress of cermet and steel connection technology in recent 20 years are reviewed, and the advantages and disadvantages of various bonding technologies are introduced, and the properties, advantages and disadvantages of common brazing metals are also introduced. On this basis, the purpose and significance of this paper are put forward. The effect of main technological parameters on the shear strength and microstructure of the joints was studied by using a self-made copper base solder and vacuum brazing to connect TiCn-based cermet and steel. The optimum technological parameters are 1060 鈩，

本文編號(hào)：1824191