本文選題：損傷演變　切入點(diǎn)：形狀因子　出處：《材料熱處理學(xué)報(bào)》2017年12期

【摘要】：利用掃描電鏡、光學(xué)顯微鏡、MTS試驗(yàn)機(jī)、顯微硬度計(jì)等分析了T2純銅薄板的顯微組織和力學(xué)性能,探討了退火溫度對(duì)T2純銅微結(jié)構(gòu)演變行為的影響。結(jié)果表明,材料的屈服應(yīng)力、拉伸應(yīng)力及顯微硬度隨著退火溫度的升高而減小。不同晶粒尺寸的材料形狀因子隨著應(yīng)變?cè)龃缶哂邢嗨频淖兓厔?shì),晶粒尺寸越大形狀因子變化越大。不同晶粒尺寸的材料相對(duì)形狀因子的變化非常相似,相對(duì)形狀因子的相對(duì)增長(zhǎng)趨勢(shì)大致相同。通過(guò)指數(shù)函數(shù)對(duì)材料的歸一化形狀因子曲線進(jìn)行了擬合,建立了擬合方程。分析了T2純銅在不同退火溫度下歸一化形狀因子隨塑性變形的演變規(guī)律。
[Abstract]:The microstructure and mechanical properties of T2 pure copper sheet were analyzed by means of scanning electron microscope, optical microscope, MTS tester and microhardness tester. The effect of annealing temperature on the evolution behavior of T2 pure copper microstructure was discussed. The tensile stress and microhardness decrease with the increase of annealing temperature. The larger the grain size, the greater the change of shape factor. The change of relative shape factor of materials with different grain sizes is very similar. The relative growth trend of the relative shape factor is approximately the same. The normalized shape factor curve of the material is fitted by exponential function. A fitting equation was established and the evolution of normalized shape factor of T2 pure copper with plastic deformation at different annealing temperatures was analyzed.
【作者單位】： 內(nèi)蒙古工業(yè)大學(xué)力學(xué)系;內(nèi)蒙古工業(yè)大學(xué)材料科學(xué)與工程學(xué)院;
【基金】：國(guó)家自然科學(xué)基金(11662011)
【分類(lèi)號(hào)】：TG166.2
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本文編號(hào)：1690957