本文關(guān)鍵詞： SPCC鋼 鍍銀 HEDP 堿性無氰 預(yù)鍍銅 組織 性能　出處：《表面技術(shù)》2017年08期 　論文類型：期刊論文

【摘要】：目的提高LED支架的性價(jià)比,減少SPCC鋼表面鍍銀預(yù)鍍銅工藝的鍍液污染,簡(jiǎn)化現(xiàn)有的預(yù)鍍鎳-鍍銅施鍍工藝,提高預(yù)鍍層質(zhì)量。方法采用HEDP堿性無氰直接預(yù)鍍銅方法來簡(jiǎn)化工藝,用單因素實(shí)驗(yàn)法,系統(tǒng)研究了電流密度、鍍液pH、電鍍溫度、HEDP/Cu~(2+)摩爾比、電鍍時(shí)間等參數(shù),對(duì)鍍層鍍速、孔隙率及鍍層表面質(zhì)量的影響,并表征鍍層的微觀組織及鍍層結(jié)合力。結(jié)果在陰極電流密度為1.41 A/dm~2,pH值為9.5,溫度為50℃,HEDP/Cu~(2+)摩爾比為3.75:1(Cu~(2+)為10 g/L),時(shí)間為11 min的條件下,可獲得鍍速約為1.7 mg/(cm~2·min)的預(yù)鍍銅層,且鍍層與基體的結(jié)合力良好,無孔隙,呈良好的光亮/半光亮狀的細(xì)晶鍍層。結(jié)論與鋼鐵表面氰化鍍銅及鍍銀前預(yù)鍍銅工藝相比,推薦的HEDP直接預(yù)鍍銅工藝的鍍層質(zhì)量好,可滿足直接鍍銅和鍍銀前預(yù)鍍銅工藝要求,可有效減少鍍液污染和簡(jiǎn)化施鍍工藝,對(duì)SPCC鋼的鍍銅工藝改善具有較好的推廣價(jià)值。
[Abstract]:Objective to improve the ratio of performance to price of LED scaffolds, reduce the contamination of the solution of silver pre-copper plating on SPCC steel surface, and simplify the existing pre-nickel plating and copper plating process. In order to improve the quality of pre-plating, HEDP alkaline cyanide-free direct preplating was used to simplify the process. The current density, bath pH and electroplating temperature were systematically studied by single factor experiment. The effects of HEDP/Cu~(2 molar ratio, electroplating time and other parameters on the plating speed, porosity and surface quality of the coating. The microstructure and adhesion of the coating were characterized. Results the cathodic current density was 1.41 A / D ~ (2 +) and pH value was 9.5, and the temperature was 50 鈩，

本文編號(hào)：1473821