本文關(guān)鍵詞：表面活性劑在陶瓷化學(xué)鍍銅工藝中的作用，由筆耕文化傳播整理發(fā)布。

表面活性劑在陶瓷化學(xué)鍍銅工藝中的作用

The Role of Surfactant in the Electroless Copper Plating on Ceramics

[1] [2] [3] [4]

ZHU Yan, KONG Xiao-yan, JIANG Qian, WANG Wei-yan （College of Chemical Engineering, Wuhan University of Technology, Wuhan 430070）

武漢理工大學(xué)化學(xué)工程學(xué)院,武漢430070

文章摘要：通過研究在鍍液中添加十六烷基三甲基溴化銨（CTAB）、十二烷基硫酸鈉（SDS）和吐溫-80三種表面活性劑對(duì)化學(xué)鍍銅沉積速率和鍍液穩(wěn)定性的影響，確定出三種添加劑的最優(yōu)添加濃度。通過掃描電鏡、能譜分析儀和X射線衍射儀，對(duì)鍍層表面形貌、組成成分以及晶體結(jié)構(gòu)分別進(jìn)行研究。并通過線性伏安掃描法，研究了添加不同表面活性劑鍍液的電化學(xué)行為。結(jié)果表明：表面活性劑可以提高化學(xué)鍍銅的沉積速率和鍍液穩(wěn)定性。CTAB、SDS和吐溫-80的最優(yōu)添加濃度分別為1mg／L、20mg／L和5mg／L。加入SDS后，由于沉積速率過大，使得鍍層顆粒變大。加入CTAB和吐溫-80可以細(xì)化鍍層的顆粒且更加致密。添加不同的表面活性劑后，，鍍層的晶粒尺寸沒有太大改變，含銅量均為100％且鍍層的晶粒呈現(xiàn)面心立方晶體結(jié)構(gòu)。表面活性劑主要通過影響甲醛的氧化反應(yīng)影響化學(xué)鍍銅過程。

Abstr：Effect of adding CTAB, SDS and Tween-80 in the electroless copper plating bath on the deposi- tion rate and bath stability were studied in this work. The optimal concentration of the three kinds of additives has been determined. The surface morphology, composition and crystal structure of the copper deposits was estimated by SEM, EDS and XRD, respectively. The electrochemical behavior of plating bath containing dif- ferent surfactants was investigated by the linear sweep voltammetry. The results show that the addition of surfactants, which significantly increases the deposition rate and improves the stability of plating bath. The optimal concentration of CTAB, SDS and Tween-80 is lmg/L, 20mg/L and 5mg/L, respectively. Adding SDS magnified the particles of copper deposits for increasing the deposition rate. Adding CTAB and Tween- 80 thinned and densified the particles of copper deposits. The crystal size of the copper deposits has changed slightly. The copper deposits contain 100 % of copper and its crystal particles have the characteristics of a face -centered cubic crystalline structure. The LSV shows that surfactant improve the process of electroless copper plating by enhancing the catalytic oxidation of formaldehyde, densifying the particles of copper deposits.

文章關(guān)鍵詞：

Keyword：:surfactant electroless copper plating bath stability plating performance

作者信息：會(huì)員可見

  本文關(guān)鍵詞：表面活性劑在陶瓷化學(xué)鍍銅工藝中的作用，由筆耕文化傳播整理發(fā)布。