【摘要】：采用六因素三水平的正交設(shè)計(jì)法優(yōu)化工藝條件,確定用電沉積的方法從廢舊印刷電路板(PCB)中提純銅制備高強(qiáng)高純銅箔的最佳工藝條件。采用掃描電鏡(SEM)、X射線衍射儀(XRD)和電感耦合等離子發(fā)射光譜分析儀(ICP)對(duì)最優(yōu)條件下制備的銅箔進(jìn)行表征;并對(duì)此銅箔的力學(xué)、電學(xué)性能和耐腐蝕性能進(jìn)行研究。結(jié)果表明,在酸性硫酸銅溶液中,采用脈沖電源,40℃下,當(dāng)周期為50 ms,占空比為0.95,電流密度為50 m A·cm~(-2),添加劑十二烷基硫酸鈉(SDS)1.5 g·L~(-1)和聚乙二醇(PEG)20 g·L~(-1)時(shí),可制備出厚度低于15μm的表面光滑均勻的銅箔,銅箔純度為99.91%。其微觀形貌為緊密堆積的圓形顆粒,平均晶粒尺寸為60 nm,具有明顯的(111)晶面擇優(yōu)取向。銅箔強(qiáng)度為337MPa,電阻率為2.8×10~(-6)Ω·cm,耐腐蝕性能優(yōu)異。采用電化學(xué)方法回收廢舊電路板金屬制取的產(chǎn)品附加值高,工藝簡單環(huán)保,而且銅的回收率可以達(dá)到67%以上。
[Abstract]:The orthogonal design method with six factors and three levels was used to optimize the process conditions and to determine the optimum process conditions for the preparation of high strength and high purity copper foil from waste printed circuit board (PCB) by electrodeposition method. (SEM), X ray diffractometer (XRD) and inductively coupled plasma emission spectrometer (ICP) were used to characterize the copper foil prepared under the optimum conditions, and the mechanical, electrical and corrosion resistance of the copper foil were studied. The results show that the current density is 50 Ma cm~ (-2) when the period is 0.95 ms, and the period is 0.95 at 40 鈩，

本文編號(hào)：2321217