新型無(wú)氰鍍鎘工藝的研究與應(yīng)用
發(fā)布時(shí)間:2019-03-02 16:12
【摘要】:引進(jìn)了新型無(wú)氰氯化鉀鍍鎘工藝,在實(shí)驗(yàn)室和生產(chǎn)線上對(duì)其工藝性能和鍍層性能進(jìn)行了研究。鍍液組成為35~40 g/L氯化鎘,140~180 g/L氯化鉀,120~160 g/L配位劑,25~35 m L/L輔助劑,1.5~2.5 m L/L光亮劑,p H為6.0~7.0,掛鍍JΚ為0.5~1.5 A/dm2,θ為15~35℃;滾鍍槽電壓4~7 V,θ為15~30℃,滾筒轉(zhuǎn)速3~7 r/min。在JΚ為1 A/dm2下電鍍,鎘的沉積速率為0.23μm/min,電流效率為72.3%。鍍層經(jīng)過(guò)低鉻彩色鈍化后進(jìn)行中性鹽霧試驗(yàn)96 h無(wú)白銹生成,504 h無(wú)紅銹生成,其耐蝕性高于氰化鍍鎘。實(shí)驗(yàn)表明,該鍍液的均鍍能力和深鍍能力、鍍層的氫脆性和耐蝕性、結(jié)合力均滿足HB 5036-92《鎘鍍層質(zhì)量檢驗(yàn)》的要求,廢水處理后鎘離子滿足GB21900-2008《電鍍污染物排放標(biāo)準(zhǔn)》的要求。
[Abstract]:A new process of cadmium plating with cyanide-free potassium chloride was introduced and its technological properties and coating properties were studied in laboratory and production line. The plating solution consists of 35 ~ 40 g / L cadmium chloride, 140 ~ 180 g / L potassium chloride, 120 / 160 g / L ligand, 25 / 35 / L auxiliary aid, 1.5 / 2.5 / L brightener, p H = 6.0 / 7.0, and on-plating J-K = 0.5 / 1.5 / L / m ~ (2). 胃 = 15 ~ 35 鈩,
本文編號(hào):2433221
[Abstract]:A new process of cadmium plating with cyanide-free potassium chloride was introduced and its technological properties and coating properties were studied in laboratory and production line. The plating solution consists of 35 ~ 40 g / L cadmium chloride, 140 ~ 180 g / L potassium chloride, 120 / 160 g / L ligand, 25 / 35 / L auxiliary aid, 1.5 / 2.5 / L brightener, p H = 6.0 / 7.0, and on-plating J-K = 0.5 / 1.5 / L / m ~ (2). 胃 = 15 ~ 35 鈩,
本文編號(hào):2433221
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