本文選題：鎳 + 電沉積�。� 參考：《電鍍與涂飾》2017年23期

【摘要】：在氯化銨配位體系電鍍鎳溶液中加入苯亞磺酸鈉(SBS)以解決鎳鍍層發(fā)黑、發(fā)脆的問題�？疾炝吮絹喕撬徕c的質(zhì)量濃度對電流效率、鍍層表面形貌和外觀的影響,以及氨水濃度、氯化銨濃度、鍍液溫度、電流密度等參數(shù)對電流效率和苯亞磺酸鈉消耗量的影響。得到最佳工藝條件為:NiCl_2·6H_2O 237.7 g/L,NH_3·H_2O 70 g/L,NH_4Cl 212 g/L,苯亞磺酸鈉100 mg/L,pH 7.5,溫度50℃,電流密度0.2 A/dm~2。該條件下電流效率達99.01%,所得鎳層為典型的面心立方結(jié)構(gòu),表面光亮、平整。
[Abstract]:Sodium benzenesulfonic acid (SBS) was added to the nickel plating solution of ammonium chloride coordination system to solve the problem of blackening and brittleness of nickel coating. The effects of sodium benzenesulfonic acid concentration on the current efficiency, surface morphology and appearance of the coating, and the effects of ammonia concentration, ammonium chloride concentration, bath temperature and current density on the current efficiency and consumption of sodium benzenesulfonate were investigated. The optimum technological conditions are as follows: 1: NiCl2 6H_2O 237.7 g / L ~ + S _ 3H _ 2O 70 g / L ~ (-1) NH _ 4Cl ~ (212) g 路L ~ (-1), pH = 7.5, temperature 50 鈩，

本文編號：1776623