本文選題：化學(xué)機(jī)械拋光　切入點(diǎn)：拋光墊　出處：《光學(xué)技術(shù)》2017年03期

【摘要】：拋光墊是化學(xué)機(jī)械拋光的重要組成部分,其磨損的非均勻性對(duì)被加工工件面型精度和拋光墊修整有重要影響�；谥本�擺動(dòng)式拋光方式,研究了拋光過(guò)程中拋光墊與工件的相對(duì)運(yùn)動(dòng),建立了拋光墊磨損模型,分析了拋光工藝參數(shù)對(duì)拋光墊磨損及均勻性的影響。研究結(jié)果表明,工件與拋光墊的轉(zhuǎn)速比為1.11,正弦偏心直線擺動(dòng)形式,擺動(dòng)幅度系數(shù)為2,擺動(dòng)頻率系數(shù)在0.1~0.2之間,拋光墊表面磨損更均勻,并根據(jù)拋光墊表面磨損特性優(yōu)化了拋光墊形狀。優(yōu)化的拋光墊具有更好的面型保持性,延長(zhǎng)了修整間隔,為拋光工藝設(shè)計(jì)提供理論指導(dǎo)。
[Abstract]:Polishing pad is an important part of chemical mechanical polishing. The non-uniformity of wear has an important effect on the precision of workpiece surface and the dressing of polishing pad. The relative movement of the polishing pad and the workpiece during the polishing process is studied, the wear model of the polishing pad is established, and the influence of the polishing process parameters on the wear and uniformity of the polishing pad is analyzed. The rotational speed ratio of the workpiece to the polishing pad is 1.11, the sinusoidal eccentric linear swing form, the swing amplitude coefficient is 2, the swing frequency coefficient is between 0.1 and 0.2, and the surface wear of the polishing pad is more uniform. The shape of the polishing pad is optimized according to the wear characteristics of the polishing pad. The optimized pad has better surface shape retention, prolongs the dressing interval, and provides theoretical guidance for the polishing process design.
【作者單位】： 南京航空航天大學(xué)機(jī)電學(xué)院;
【基金】：中國(guó)博士后科學(xué)基金特別資助項(xiàng)目(2016T90451) 航空科學(xué)基金(2015ZE52056)
【分類(lèi)號(hào)】：TQ050

【相似文獻(xiàn)】

相關(guān)期刊論文 前2條

1 樊吉龍;朱永偉;李軍;李茂;葉劍鋒;左敦穩(wěn);;金剛石丸片與固結(jié)磨料拋光墊研磨硅片的比較研究[J];硅酸鹽通報(bào);2010年06期

2 ;[J];;年期

相關(guān)碩士學(xué)位論文 前1條

1 孫朋;碳化硅陶瓷研拋的流場(chǎng)仿真及其摩擦磨損性能研究[D];哈爾濱工業(yè)大學(xué);2015年

，

本文編號(hào)：1660745