本文選題：藍(lán)寶石　切入點(diǎn)：固結(jié)磨料研磨技術(shù)　出處：《大連理工大學(xué)》2015年碩士論文

【摘要】：單晶藍(lán)寶石是一種多功能晶體材料,除具有優(yōu)良的物理性能、化學(xué)性能和光學(xué)性外,其還具有透光性好,熔點(diǎn)高,硬度高,電絕緣性?xún)?yōu)良,熱傳導(dǎo)性良好,化學(xué)性能穩(wěn)定等特性,在國(guó)防、超導(dǎo)、光電子、微電子等領(lǐng)域具有廣泛的應(yīng)用。無(wú)論是用于國(guó)防領(lǐng)域的紅外探測(cè)器的藍(lán)寶石窗口,還是用于LED行業(yè)的藍(lán)寶石基片,對(duì)藍(lán)寶石的加工精度(面型精度、尺寸精度等)和加工表面完整性提出了很高的要求。傳統(tǒng)游離磨料研磨、化學(xué)機(jī)械拋光藍(lán)寶石加工工藝,其加工效率低,加工成本高,加工精度不穩(wěn)定,很難實(shí)現(xiàn)自動(dòng)化等缺點(diǎn)制約了藍(lán)寶石晶體加工技術(shù)的發(fā)展。因此,研究和開(kāi)發(fā)一種新型高效低損傷藍(lán)寶石加工工藝尤為重要。本文以提高加工后藍(lán)寶石表面質(zhì)量和縮短加工時(shí)間為目標(biāo),提出采用固結(jié)金剛石研磨盤(pán)粗磨獲得所需的尺寸精度和面型精度,采用機(jī)械化學(xué)拋光盤(pán)拋光獲得超光滑表面。論文主要研究?jī)?nèi)容如下：(1)在游離磨料研磨的基礎(chǔ)上提出采用固結(jié)金剛石研磨盤(pán)研磨技術(shù)對(duì)藍(lán)寶石進(jìn)行加工,分析了固結(jié)金剛石研磨盤(pán)加工原理以及修整方法。對(duì)固結(jié)金剛石研磨盤(pán)技術(shù)進(jìn)行了探索,以加工后藍(lán)寶石的表面質(zhì)量和材料去除率作為衡量標(biāo)準(zhǔn),對(duì)比了不同結(jié)合劑、不同磨料粒度金剛石研磨盤(pán)的研磨性能。(2)采用截面顯微法和角度拋光法對(duì)固結(jié)金剛石研磨盤(pán)加工后的藍(lán)寶石亞表面損傷層進(jìn)行檢測(cè)�？偨Y(jié)裂紋類(lèi)型,分析亞表面裂紋成型原因。探索固結(jié)金剛石研磨技術(shù)中,磨料粒徑與藍(lán)寶石亞表面損傷層深度之間的關(guān)系。(3)針對(duì)傳統(tǒng)藍(lán)寶石平坦化CMP技術(shù)不足,提出固結(jié)磨料機(jī)械化學(xué)拋光技術(shù),通過(guò)化學(xué)和機(jī)械共同作用達(dá)到去除材料的目的。針對(duì)藍(lán)寶石的物理化學(xué)特性,研制了藍(lán)寶石專(zhuān)用的機(jī)械化學(xué)拋光盤(pán)并提出了專(zhuān)用修整方法。采用恒壓力研磨機(jī)為工作平臺(tái),對(duì)機(jī)械化學(xué)拋光盤(pán)進(jìn)行實(shí)驗(yàn)驗(yàn)證。(4)將固結(jié)金剛石磨盤(pán)研磨技術(shù)與固結(jié)磨料機(jī)械化學(xué)拋光技術(shù)相集成,設(shè)計(jì)了一種高效低損傷的藍(lán)寶石加工工藝：采用W20固結(jié)金剛石研磨盤(pán)粗磨,去除加工余量,獲得所需尺寸精度；然后采用W7固結(jié)金剛石研磨盤(pán)精磨,提高面型精度和表面質(zhì)量,降低加工后的亞表面損傷層深度；最后采用機(jī)械化學(xué)拋光盤(pán)對(duì)藍(lán)寶石進(jìn)行拋光,去除由金剛石研磨盤(pán)加工帶入的亞表面損傷,獲得光滑的藍(lán)寶石表面質(zhì)量。
[Abstract]:Single crystal sapphire is a kind of multifunctional crystal material. In addition to its excellent physical, chemical and optical properties, it also has good transmittance, high melting point, high hardness, excellent electrical insulation and good thermal conductivity. Chemical stability has been widely used in the fields of national defense, superconducting, optoelectronics, microelectronics and so on. Whether it is used in the sapphire window of infrared detectors in the field of national defense or in the sapphire substrate of the LED industry, The machining accuracy (surface precision, dimension precision, etc.) and the surface integrity of sapphire are very high. The traditional free abrasive grinding and chemical mechanical polishing sapphire processing technology have low processing efficiency and high processing cost. The development of sapphire crystal processing technology is restricted by the instability of machining precision and the difficulty of automating. It is very important to study and develop a new high efficiency and low damage sapphire processing technology. The aim of this paper is to improve the surface quality and shorten the processing time of sapphire. In this paper, the size accuracy and surface shape accuracy are obtained by rough grinding of consolidated diamond grinding disc. The super-smooth surface is obtained by mechanochemical polishing of optical disk. The main contents of this paper are as follows: (1) on the basis of free abrasive grinding, a new technique of grinding sapphire with consolidated diamond lapping disk is proposed. The machining principle and dressing method of bonded diamond abrasive disc are analyzed. The technology of consolidated diamond grinding disc is explored. The surface quality and material removal rate of sapphire after processing are taken as the measurement standard, and the different binders are compared. The abrasive properties of diamond lapping discs with different abrasive sizes. (2) using cross section microscopy and angle polishing method to detect the subsurface damage layer of sapphire after processing of bonded diamond lapping disc. The types of cracks are summarized. This paper analyzes the causes of subsurface crack forming, explores the relationship between abrasive particle size and the depth of sapphire subsurface damage layer in the grinding technology of consolidated diamond, and aims at the shortage of traditional sapphire flattening CMP technology. This paper puts forward the technology of mechanical chemical polishing of consolidated abrasive, which can remove the material by chemical and mechanical interaction. The physical and chemical properties of sapphire are discussed. A special mechanochemical polishing disc for sapphire was developed and a special dressing method was put forward. The constant pressure grinder was used as the working platform. An experimental verification of mechanochemical polishing disc is made. (4) the grinding technology of consolidated diamond disc is integrated with the mechanical chemical polishing technology of consolidated abrasive material, and a high efficiency and low damage sapphire processing technology is designed: the rough grinding of W20 consolidated diamond grinding disk is adopted. The machining allowance is removed to obtain the required dimension precision, and then the W7 consolidated diamond grinding disk is used to improve the surface shape accuracy and surface quality, and to reduce the depth of the damaged subsurface layer after processing. Finally, the sapphire was polished by mechanochemical polishing disc to remove the sub-surface damage caused by diamond grinding disc, and the smooth sapphire surface quality was obtained.
【學(xué)位授予單位】：大連理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TQ164.2

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本文編號(hào)：1653993