本文選題：無氰電鍍　切入點：金-銅合金　出處：《大連理工大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：金及其合金鍍層因其優(yōu)異的物理化學(xué)性能,廣泛應(yīng)用于現(xiàn)代電子工業(yè)中,適用于制造對于電參數(shù)性能長期穩(wěn)定性要求較高的零件。傳統(tǒng)的氰化物鍍金工藝,鍍液具有良好的分散能力和覆蓋能力、電流效率高、穩(wěn)定性好,所得鍍層的表面質(zhì)量好。但是,傳統(tǒng)的氰化物鍍金工藝,因其選用氰化物為金的配合物,鍍液毒性大,對操作工人的危害較大,同時不利于環(huán)保。因此,新型的無氰電鍍工藝成為了當(dāng)代電鍍工作者的主要研究方向。本文通過對比研究無氰亞硫酸鈉-檸檬酸銨電鍍工藝和無氰亞硫酸鈉-絡(luò)合物α電鍍工藝,綜合考慮鍍層和鍍液的性能,最終確定無氰亞硫酸鈉-絡(luò)合物α工藝為主要研究對象。通過正交試驗,以鍍層外觀、鍍層硬度和鍍液沉積速率為評價指標(biāo),得到無氰亞硫酸鈉-絡(luò)合物α電鍍金-銅工藝優(yōu)化配方：金10g/L,硫酸銅1g/L,無水亞硫酸鈉170g/L硫酸鉀80g/L,絡(luò)合物a60g/L。同時,研究了不同電鍍工藝參數(shù)對鍍層表面質(zhì)量和鍍液沉積速率的影響,通過單因素試驗最終確定了優(yōu)選工藝參數(shù)為：電流密度0.3A/dm2、電鍍溫度60℃、占空比10%、脈沖頻率1000Hz、鍍液pH值9、攪拌速度1000r/min。無氰脈沖亞硫酸鈉-絡(luò)合物α電鍍工藝,鍍液穩(wěn)定性好,覆蓋能力和分散能力優(yōu)異,電流效率為82.23%。所得的金-銅合金鍍層結(jié)合力良好、耐蝕性好；鍍層硬度為190.43Hv,遠(yuǎn)超純金或紫銅的硬度；XRD測試結(jié)果表明,鍍層由Au3Cu固溶體組成；XRF測試結(jié)果表明鍍層金質(zhì)量分?jǐn)?shù)90.23%,銅質(zhì)量分?jǐn)?shù)9.77%。
[Abstract]:Gold and its alloy coatings are widely used in modern electronic industry because of their excellent physical and chemical properties. The plating bath has good dispersion and covering ability, high current efficiency, good stability and good surface quality. However, the traditional cyanide gold plating process is highly toxic because of its choice of cyanide as the gold complex. It is not only harmful to the operation workers, but also harmful to environmental protection. A new type of cyanide-free electroplating process has become the main research direction of modern electroplating workers. In this paper, the electroplating process of non-cyanide sulfite ammonium citrate electroplating and non-cyanide sodium sulfite complex 偽 electroplating process are studied. Synthetically considering the properties of coating and bath, the process of non-cyanide sodium sulfite complex 偽 was determined as the main research object. Through orthogonal test, the coating appearance, coating hardness and deposition rate of plating solution were taken as the evaluation index. The optimized formula for gold / copper plating without cyanide sulfite complex 偽: gold 10 g / L, copper sulfate 1 g / L, anhydrous sodium sulfite 170 g / L potassium sulfate 80 g / L, complex a 60 g / L. at the same time, The effects of electroplating parameters on the surface quality and deposition rate of plating bath were studied. The optimum process parameters were determined by single factor experiment: current density 0.3A / dm2, electroplating temperature 60 鈩，

本文編號：1562286