某高碼率通信終端處理機(jī)熱設(shè)計(jì)與仿真分析
發(fā)布時(shí)間：2021-08-10 00:14
處理機(jī)是飛行器高碼率通信終端核心電子設(shè)備,處理機(jī)穩(wěn)定性與可靠性的高低直接關(guān)系到整個(gè)終端系統(tǒng)設(shè)備的可靠性工作。介紹高碼率通信終端處理機(jī)熱設(shè)計(jì)的特點(diǎn)與方法,針對(duì)不同的功率器件和組件,與結(jié)構(gòu)設(shè)計(jì)相結(jié)合,探索合理的散熱途徑,特別是許多熱耗較大的功率器件的熱設(shè)計(jì)。通過熱仿真分析,優(yōu)化熱設(shè)計(jì)方案,控制每個(gè)器件的溫升滿足設(shè)計(jì)要求,并進(jìn)行了熱真空、熱平衡試驗(yàn)驗(yàn)證。
【文章來源】：遙測(cè)遙控. 2020,41(01)
【文章頁數(shù)】：8 頁
【部分圖文】：
處理機(jī)散熱路徑圖Fig.3Heatdissipationpathofprocessor作可靠性。所示
2020年1月遙測(cè)遙控·55·圖4調(diào)制解調(diào)模塊溫度云圖Fig.4Temperaturenephogramofmodemmodule圖5激光收發(fā)模塊溫度云圖Fig.5Temperaturenephogramoflasertransceivermodule圖6綜合接口與伺服控制模塊溫度云圖Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule圖7供配電模塊溫度云圖Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高溫工況計(jì)算結(jié)果Table1Calculationsofhightemperatureconditions所屬模塊序號(hào)元器件名稱熱耗（W）結(jié)殼熱阻（℃/W）殼溫（℃）結(jié)溫（℃）I級(jí)降額溫度（℃）調(diào)制解調(diào)模塊1電源模塊LDO-10.5745.8649.36852頻綜-10.553049.2665.76853頻綜-20.753055.7078.20854頻綜-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收發(fā)器10.42.9657.8359.0285D5收發(fā)器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
2020年1月遙測(cè)遙控·55·圖4調(diào)制解調(diào)模塊溫度云圖Fig.4Temperaturenephogramofmodemmodule圖5激光收發(fā)模塊溫度云圖Fig.5Temperaturenephogramoflasertransceivermodule圖6綜合接口與伺服控制模塊溫度云圖Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule圖7供配電模塊溫度云圖Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高溫工況計(jì)算結(jié)果Table1Calculationsofhightemperatureconditions所屬模塊序號(hào)元器件名稱熱耗（W）結(jié)殼熱阻（℃/W）殼溫（℃）結(jié)溫（℃）I級(jí)降額溫度（℃）調(diào)制解調(diào)模塊1電源模塊LDO-10.5745.8649.36852頻綜-10.553049.2665.76853頻綜-20.753055.7078.20854頻綜-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收發(fā)器10.42.9657.8359.0285D5收發(fā)器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
本文編號(hào)：3333057
【文章來源】：遙測(cè)遙控. 2020,41(01)
【文章頁數(shù)】：8 頁
【部分圖文】：
處理機(jī)散熱路徑圖Fig.3Heatdissipationpathofprocessor作可靠性。所示
2020年1月遙測(cè)遙控·55·圖4調(diào)制解調(diào)模塊溫度云圖Fig.4Temperaturenephogramofmodemmodule圖5激光收發(fā)模塊溫度云圖Fig.5Temperaturenephogramoflasertransceivermodule圖6綜合接口與伺服控制模塊溫度云圖Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule圖7供配電模塊溫度云圖Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高溫工況計(jì)算結(jié)果Table1Calculationsofhightemperatureconditions所屬模塊序號(hào)元器件名稱熱耗（W）結(jié)殼熱阻（℃/W）殼溫（℃）結(jié)溫（℃）I級(jí)降額溫度（℃）調(diào)制解調(diào)模塊1電源模塊LDO-10.5745.8649.36852頻綜-10.553049.2665.76853頻綜-20.753055.7078.20854頻綜-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收發(fā)器10.42.9657.8359.0285D5收發(fā)器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
2020年1月遙測(cè)遙控·55·圖4調(diào)制解調(diào)模塊溫度云圖Fig.4Temperaturenephogramofmodemmodule圖5激光收發(fā)模塊溫度云圖Fig.5Temperaturenephogramoflasertransceivermodule圖6綜合接口與伺服控制模塊溫度云圖Fig.6Temperaturecloudofintegratedinterfaceandservocontrolmodule圖7供配電模塊溫度云圖Fig.7Temperaturecloudofpowersupplyanddistributionmodule表1高溫工況計(jì)算結(jié)果Table1Calculationsofhightemperatureconditions所屬模塊序號(hào)元器件名稱熱耗（W）結(jié)殼熱阻（℃/W）殼溫（℃）結(jié)溫（℃）I級(jí)降額溫度（℃）調(diào)制解調(diào)模塊1電源模塊LDO-10.5745.8649.36852頻綜-10.553049.2665.76853頻綜-20.753055.7078.20854頻綜-30.83055.4279.42855信道_WG1.45/49.27/856放大器0.39052.8979.8985D1AD6.354.358.6085.9185D2DA1.63.350.8556.1385D3FPGA150.2459.8463.4485D4LDO-10.83.761.4864.4485D5收發(fā)器10.42.9657.8359.0285D5收發(fā)器20.42.9658.1859.3685D6LDO-20.83.761.0263.9885D7LDO-30.323.754.5455.7285D8DC/DC-10.40.5264.4964.7085D9DC/DC-210.5278.7279.2485
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