發(fā)布時間：2019-06-12 18:18

【摘要】：使用化學亞胺化法合成可溶性聚酰亞胺,在銅箔上涂布可溶性聚酰亞胺和熱塑性聚酰亞胺前驅(qū)體混合液,經(jīng)過高溫亞胺化得到無膠單面覆銅板,再與銅箔進行高溫壓合最終制得無膠雙面覆銅板。通過測試雙面覆銅板的剝離強度和PI復合膜的玻璃化轉(zhuǎn)變溫度、熱分解溫度、熱膨脹系數(shù)和介電性能,評價其應(yīng)用于無膠雙面覆銅板的可行性。結(jié)果表明:基材的介電常數(shù)為2.5~2.7,介質(zhì)損耗因數(shù)為0.004~0.006,剝離強度大于1.0 N/mm,同時熱膨脹系數(shù)較低。該結(jié)構(gòu)無膠雙面覆銅板具有較好的綜合性能,可應(yīng)用于高頻高速撓性覆銅板領(lǐng)域。
[Abstract]:Soluble polyimide was synthesized by chemical imidization, and the mixture of soluble polyimide and thermoplastic polyimide precursor was coated on copper foil. The non-adhesive single-sided copper laminate was obtained by high temperature imidization, and then the adhesive-free double-sided copper laminate was prepared by high temperature pressing with copper foil. By measuring the peeling strength of double-sided copper laminate and the glass transition temperature, thermal decomposition temperature, thermal expansion coefficient and dielectric properties of PI composite film, the feasibility of its application to non-adhesive double-sided copper laminate was evaluated. The results show that the dielectric constant of the substrate is 2.5 鈮，

本文編號：2498209