基于Genesis軟件的特性阻抗板的設(shè)計(jì)與實(shí)現(xiàn)
發(fā)布時間：2019-04-27 15:50
【摘要】：印制電路板(Printed Circuit Board,PCB)的特性阻抗必須與頭尾元件的電子阻抗匹配才能保證PCB信號傳輸?shù)耐暾�。本文主要從PCB設(shè)計(jì)與制作的角度提出解決其阻抗匹配的方法。從設(shè)計(jì)理論的角度分析了影響阻抗板控制的各種因素,同時對線寬、線路銅厚、介電層厚度、相對介電常數(shù)等影響因素,進(jìn)行了進(jìn)一步分析,提出了各個因素的一般執(zhí)行標(biāo)準(zhǔn),確認(rèn)了重點(diǎn)影響因素,為計(jì)算阻抗值提供了依據(jù)。再者通過介紹高頻電路理論,傳輸線理論和阻抗產(chǎn)生原因和影響等,總結(jié)了如何解決系統(tǒng)設(shè)計(jì)過程因?yàn)樽杩沟挠绊懚霈F(xiàn)的問題,為設(shè)計(jì)階段提供了可靠的理論基礎(chǔ)。應(yīng)用Protel99se軟件,在CAD(Computer Aided Design,計(jì)算機(jī)輔助設(shè)計(jì))設(shè)計(jì)階段,研究了阻抗PCB的設(shè)計(jì)流程和設(shè)計(jì)重點(diǎn),分別討論了如何按照設(shè)計(jì)流程來實(shí)現(xiàn)阻抗板的設(shè)計(jì)以及在設(shè)計(jì)過程中如何把握設(shè)計(jì)規(guī)則,約束設(shè)計(jì)條件。然后在布局過程中引進(jìn)了工程約束規(guī)則,探討了在整個阻抗PCB設(shè)計(jì)過程中的一些經(jīng)驗(yàn)和技巧,加快了布局問題的求解,并按實(shí)際的約束條件和經(jīng)驗(yàn)布局布線。在分析了各模塊原理的基礎(chǔ)上,完成了電路原理圖和整個系統(tǒng)的PCB設(shè)計(jì)�；贕enesi2000軟件設(shè)計(jì)出了高頻PCB的CAM(Computer Aided Manufacture,計(jì)算機(jī)輔助制造)作業(yè)流程,設(shè)計(jì)制作出了符合客戶要求并在工廠制程能力范圍內(nèi)的PCB照相底片資料和鉆孔資料,最后并針對Genesis2000軟件在制作工程資料過程中較為繁瑣的工作,使用C Shell語言在Window7環(huán)境下設(shè)計(jì)開發(fā)出符合阻抗板工程設(shè)計(jì)的阻抗條自動化腳本�；贕enesi2000軟件研究了如何實(shí)現(xiàn)阻抗PCB的工藝。對現(xiàn)有公司的不良產(chǎn)品進(jìn)行分析,對電鍍均勻性、人為和設(shè)備因素進(jìn)行了改善,如對垂直連續(xù)電鍍線(Vertical Continuous Plating,VCP)更換夾具夾板方式、改換大V型座、更改電鍍槽鈦籃尺寸及形狀等.針對蝕刻不均勻的原因進(jìn)行DOE(Design Of Experiments,試驗(yàn)設(shè)計(jì))分析,得到蝕刻均勻性的最佳參數(shù)組合為:采用酸槽速度2.2~3.1m/min,酸液濃度4.5~5.5mol/L,溶液溫度45±5℃,蝕刻噴壓0.1~0.2Mpa。緊接著采用改善后工藝,嚴(yán)格遵守各工序要求,完成了阻抗PCB的制作,未發(fā)現(xiàn)有品質(zhì)問題,并且完成阻抗測試。后續(xù)研究該著重推廣阻抗PCB設(shè)計(jì)階段的改善以及工藝的改善,達(dá)到批量化的應(yīng)用。
[Abstract]:The characteristic impedance of printed circuit board (Printed Circuit Board,PCB) must match with the electronic impedance of the head and tail components in order to ensure the integrity of PCB signal transmission. In this paper, a method to solve the impedance matching of PCB is put forward from the point of view of design and fabrication. The factors that influence the control of the impedance plate are analyzed from the point of view of design theory. At the same time, the influence factors such as linewidth, copper thickness, dielectric layer thickness, relative dielectric constant and so on are further analyzed, and the general implementation standard of each factor is put forward. The key influencing factors are confirmed and the basis for calculating impedance value is provided. Furthermore, by introducing the theory of high frequency circuit, transmission line theory and the causes and effects of impedance, this paper summarizes how to solve the problems caused by the impedance in the design process of the system, which provides a reliable theoretical basis for the design stage. In the design phase of CAD (Computer Aided Design, (computer aided Design), using Protel99se software, the design flow and key points of impedance PCB are studied. This paper discusses how to realize the design of the impedance plate according to the design flow and how to grasp the design rules and restrict the design conditions in the design process. Then the engineering constraint rules are introduced in the layout process, some experiences and skills in the whole impedance PCB design process are discussed, and the solution of the layout problem is speeded up, and the layout is arranged according to the actual constraint conditions and experience. On the basis of analyzing the principle of each module, the circuit schematic diagram and the PCB design of the whole system are completed. Based on Genesi2000 software, the CAM (Computer Aided Manufacture, computer aided manufacturing (CAM (Computer Aided Manufacture,) operation flow of high frequency PCB is designed, and the PCB photographic film data and drilling hole data which accord with the customer's requirements and within the scope of the factory process ability are designed and produced. Finally, in view of the tedious work of Genesis2000 software in making engineering data, the impedance bar automation script is designed and developed by using C-Shell language in the environment of Window7, which accords with the engineering design of impedance plate. Based on Genesi2000 software, how to realize the process of impedance PCB is studied. This paper analyzes the bad products of the existing company, improves the uniformity of electroplating, man-made and equipment factors, such as changing clamp splint mode of vertical continuous plating line (Vertical Continuous Plating,VCP) and changing large V-type seat. Change the size and shape of plating bath titanium basket. According to the reason of non-uniform etching, the DOE (Design Of Experiments, test design was carried out, and the optimum parameters of etching uniformity were obtained as follows: acid groove velocity 2.2 ~ 3.1mmin, acid concentration 4.5 ~ 5.5 mol / L, solution temperature 45 鹵5 鈩，
本文編號：2467104
[Abstract]:The characteristic impedance of printed circuit board (Printed Circuit Board,PCB) must match with the electronic impedance of the head and tail components in order to ensure the integrity of PCB signal transmission. In this paper, a method to solve the impedance matching of PCB is put forward from the point of view of design and fabrication. The factors that influence the control of the impedance plate are analyzed from the point of view of design theory. At the same time, the influence factors such as linewidth, copper thickness, dielectric layer thickness, relative dielectric constant and so on are further analyzed, and the general implementation standard of each factor is put forward. The key influencing factors are confirmed and the basis for calculating impedance value is provided. Furthermore, by introducing the theory of high frequency circuit, transmission line theory and the causes and effects of impedance, this paper summarizes how to solve the problems caused by the impedance in the design process of the system, which provides a reliable theoretical basis for the design stage. In the design phase of CAD (Computer Aided Design, (computer aided Design), using Protel99se software, the design flow and key points of impedance PCB are studied. This paper discusses how to realize the design of the impedance plate according to the design flow and how to grasp the design rules and restrict the design conditions in the design process. Then the engineering constraint rules are introduced in the layout process, some experiences and skills in the whole impedance PCB design process are discussed, and the solution of the layout problem is speeded up, and the layout is arranged according to the actual constraint conditions and experience. On the basis of analyzing the principle of each module, the circuit schematic diagram and the PCB design of the whole system are completed. Based on Genesi2000 software, the CAM (Computer Aided Manufacture, computer aided manufacturing (CAM (Computer Aided Manufacture,) operation flow of high frequency PCB is designed, and the PCB photographic film data and drilling hole data which accord with the customer's requirements and within the scope of the factory process ability are designed and produced. Finally, in view of the tedious work of Genesis2000 software in making engineering data, the impedance bar automation script is designed and developed by using C-Shell language in the environment of Window7, which accords with the engineering design of impedance plate. Based on Genesi2000 software, how to realize the process of impedance PCB is studied. This paper analyzes the bad products of the existing company, improves the uniformity of electroplating, man-made and equipment factors, such as changing clamp splint mode of vertical continuous plating line (Vertical Continuous Plating,VCP) and changing large V-type seat. Change the size and shape of plating bath titanium basket. According to the reason of non-uniform etching, the DOE (Design Of Experiments, test design was carried out, and the optimum parameters of etching uniformity were obtained as follows: acid groove velocity 2.2 ~ 3.1mmin, acid concentration 4.5 ~ 5.5 mol / L, solution temperature 45 鹵5 鈩，
本文編號：2467104
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