印制線路板上硫氰酸亞金鉀體系化學鍍金
發(fā)布時間：2019-03-19 11:38
【摘要】：以硫氰酸亞金鉀[KAu(SCN)_2]為金源對鍍鎳印制線路板進行化學鍍金。采用單因素試驗研究了鍍液中Au~+含量、硫氰酸銨含量、pH和溫度對沉金速率、金層外觀和結合力的影響,得到最優(yōu)配方和工藝參數為:Au~+2.0 g/L,硫氰酸銨15 g/L,添加劑Cy-808 150 mL/L,pH 3.0,溫度50℃。在此條件下沉金速率約為6 nm/min,結晶均勻細致,呈光亮的金黃色。
[Abstract]:Electroless gold plating on nickel-plated printed circuit board was carried out with potassium thiocyanate [KAu (SCN) _ 2] as gold source. The effects of Au~ content, ammonium thiocyanate content, pH and temperature on gold deposition rate, appearance and binding force of gold layer were studied by single factor test. The optimum formula and technological parameters were obtained as follows: Au~ 2.0g / L, ammonium thiocyanate 15g / L, Additive Cy-808 150 mL/L,pH 3.0, temperature 50 鈩，
本文編號：2443486
[Abstract]:Electroless gold plating on nickel-plated printed circuit board was carried out with potassium thiocyanate [KAu (SCN) _ 2] as gold source. The effects of Au~ content, ammonium thiocyanate content, pH and temperature on gold deposition rate, appearance and binding force of gold layer were studied by single factor test. The optimum formula and technological parameters were obtained as follows: Au~ 2.0g / L, ammonium thiocyanate 15g / L, Additive Cy-808 150 mL/L,pH 3.0, temperature 50 鈩，
本文編號：2443486
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