【摘要】：在電子元器件封裝領(lǐng)域中,塑封器件正逐步替代氣密性封裝器件。目前工業(yè)級塑封器件已不能滿足器件的高可靠性要求,工業(yè)級塑封器件在嚴(yán)酷的環(huán)境應(yīng)力試驗中經(jīng)常出現(xiàn)失效。研究了工業(yè)級塑封器件在可靠性篩選試驗中出現(xiàn)失效的問題,通過X射線觀察和芯片切面分析等方法,查明了造成器件失效的原因,并提出了優(yōu)化改進(jìn)措施。
[Abstract]:In the field of electronic components packaging, plastic packaging devices are gradually replacing airtight packaging devices. At present, the industrial plastic sealing device can not meet the high reliability requirements of the device, and the industrial plastic sealing device often fails in the severe environmental stress test. The failure of industrial plastic sealing devices in reliability screening tests was studied. By means of X-ray observation and chip section analysis, the causes of device failure were found out, and the optimization and improvement measures were put forward.
【作者單位】： 中國電子科技集團(tuán)公司第二十四研究所;
【分類號】：TN405

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