【摘要】：在全球經(jīng)濟迅猛發(fā)展的背景下,能源供給的緊張局面日益加劇。面對如此緊迫的危機,我國政府全力提倡可持續(xù)發(fā)展戰(zhàn)略,既要加速開辟新的可再生能源,更要全民參與低碳生活政策。在各種新能源中,最受矚目的要數(shù)半導(dǎo)體發(fā)光二極管,簡稱LED。相對于傳統(tǒng)光源,LED憑借著電光轉(zhuǎn)換效率高、使用壽命長、響應(yīng)速度快以及抗震性能好等優(yōu)點,廣泛應(yīng)用于日常生活中的各個領(lǐng)域,被評為新世紀最有價值的照明光源。隨著LED應(yīng)用領(lǐng)域的逐漸擴大,人們對LED的輸出功率以及光效的要求也在不斷攀升。高功率、高集成度的發(fā)展趨勢給LED封裝行業(yè)帶來了前所未有的挑戰(zhàn)。研究者們通過研發(fā)新型封裝材料、改變封裝結(jié)構(gòu)等方式,來解決光效、散熱、光色以及成本控制等一系列難題。本文以最近研究火熱的玻璃基板燈絲球泡燈為契機,采用COB(chip on board,板上芯片)封裝結(jié)構(gòu),對玻璃材質(zhì)作為LED封裝基板的性能進行研究�；诓ＡЩ錍OB器件,本文主要進行了以下幾個方面的研究工作:1、針對不同基板材質(zhì),選取常用陶瓷、普通的硅酸鹽玻璃、銅、硅和鋁等基板進行樣品制作和性能對比實驗。分析測試數(shù)據(jù)知:17串1并的條狀玻璃基板COB樣品在49V、20m A的工作狀態(tài)下,92℃的膠面溫度高于其它樣品,卻有著和陶瓷基板COB器件相近的76 lm光通量。2、為改善玻璃基板COB器件散熱性能,設(shè)計了鋁材彈片、鋁材卡口和玻璃基板背面刷銀層的實驗方案。得知采用鋁材卡口+基板背面刷銀層的方式散熱效果最理想。3、設(shè)計對比實驗,研究了背面銀層厚度與散熱性能和光通量的關(guān)系。當銀層厚度為75um時,達到了比較理想的散熱和發(fā)光效果。膠體表面溫度為91.5℃,3.6W的玻璃條球泡燈在穩(wěn)定狀態(tài)下的光通量達到315 lm。4、針對玻璃基板COB器件的可靠性,進行了高溫高濕、冷熱沖擊和紅墨水硫磺實驗,并與市場主流的Al2O3陶瓷基板進行了對比分析。實驗結(jié)果表明玻璃基板COB器件能夠順利的通過可靠性實驗,背面刷銀層后,可靠性效果更優(yōu)。本文通過制樣和對比分析,對玻璃材質(zhì)作為COB的封裝基板進行了研究,并設(shè)計了一些簡單的方法改善玻璃基板的散熱性能。為未來大功率集成式玻璃基板COB封裝結(jié)構(gòu)的研究提供參考。
[Abstract]:In the context of the rapid development of the global economy, the tension of energy supply is increasing day by day. In the face of such an urgent crisis, our government fully advocates the strategy of sustainable development. It is necessary to accelerate the development of new renewable energy sources and to participate in low-carbon living policies. Of all the new sources of energy, semiconductor light-emitting diodes (LED.) are the most popular ones. Compared with the traditional light source, LED is widely used in every field of daily life because of its advantages of high efficiency of electro-optic conversion, long service life, fast response speed and good seismic performance, and is regarded as the most valuable lighting source in the new century. With the gradual expansion of LED applications, the demand for LED output power and light efficiency is also increasing. The development trend of high power and high integration has brought unprecedented challenges to LED packaging industry. Researchers solve a series of problems such as light efficiency, heat dissipation, light color and cost control by developing new packaging materials and changing packaging structure. In this paper, the recent research on the hot glass substrate filament bulb lamp is taken as the turning point, and the performance of the glass material as the LED packaging substrate is studied by using the COB (chip on board, on-board chip) packaging structure. Based on the glass substrate COB device, this paper mainly carried out the following research work: 1, for different substrate materials, common ceramic, common silicate glass, copper, Silicon and aluminum substrates were prepared and the properties were compared. The experimental data show that the surface temperature at 92 鈩，

本文編號：2358260