【摘要】：由于信息技術(shù)的快速發(fā)展,半導(dǎo)體工業(yè)跟隨著取得了持續(xù)的進(jìn)步。封裝測(cè)試作為半導(dǎo)體工業(yè)的重要部分,對(duì)IC產(chǎn)品的整體性能和品質(zhì)起到至關(guān)重要的作用。如今移動(dòng)電子設(shè)備市場(chǎng)迅猛發(fā)展,許多手機(jī)、平板電腦、相機(jī)等消費(fèi)電子產(chǎn)品都開始涉及POP(package-on-package)形式的封裝,其可靠性受到的重視程度越來越高。更多的新產(chǎn)品要求提升產(chǎn)品性能的同時(shí)縮小產(chǎn)品的尺寸,POP的出現(xiàn)滿足了這樣的要求,開始獲得廣泛應(yīng)用。但是由于封裝密度的不斷提高,電子產(chǎn)品在使用過程中會(huì)因熱量累積而影響其可靠性。本文針對(duì)POP封裝在溫度環(huán)境下的可靠性進(jìn)行了研究,主要做了如下工作:利用實(shí)驗(yàn)方法測(cè)試了14mm POP芯片在溫度沖擊環(huán)境下的應(yīng)變特性,得出芯片頂層和底層焊點(diǎn)的應(yīng)變值大小。對(duì)14mm和15mm POP芯片進(jìn)行了溫度循環(huán)與溫度沖擊離線耦合環(huán)境下的測(cè)試,得出芯片頂層和底層焊點(diǎn)應(yīng)變值大小。無論溫度沖擊環(huán)境還是離線耦合環(huán)境,POP頂層焊點(diǎn)和底層焊點(diǎn)應(yīng)變都呈現(xiàn)出周期性變化規(guī)律,在沖擊過程中應(yīng)變變化較大,而且底層焊點(diǎn)的應(yīng)變整體上大于頂層焊點(diǎn)。根據(jù)應(yīng)變值大小可得出其相應(yīng)的可靠性壽命。通過POP溫度沖擊環(huán)境下有限元模擬分析得知,應(yīng)力主要集中在焊點(diǎn)和芯片。底層芯片最大應(yīng)力大于頂層的兩塊芯片。底層焊點(diǎn)應(yīng)力整體上大于頂層焊點(diǎn),且底層焊點(diǎn)應(yīng)力最大值在最外圈角端焊點(diǎn)上。對(duì)相同芯片在溫度沖擊和離線耦合環(huán)境下的應(yīng)變變化進(jìn)行對(duì)比分析,溫度沖擊下焊點(diǎn)應(yīng)變從零開始,而離線耦合下應(yīng)變有一個(gè)起始值,說明離線耦合實(shí)驗(yàn)中溫度循環(huán)對(duì)其產(chǎn)生了一定的殘余應(yīng)力。離線耦合環(huán)境下焊點(diǎn)應(yīng)變整體上大于溫度沖擊環(huán)境下的應(yīng)變,焊點(diǎn)更容易發(fā)生失效。相同的溫度循環(huán)與溫度沖擊離線耦合環(huán)境下對(duì)不同尺寸的封裝測(cè)試結(jié)果進(jìn)行了對(duì)比分析,14mm POP和15mm POP的應(yīng)變起始值都不為零,15mm POP的應(yīng)變整體上要大于14mm POP的應(yīng)變,尤其是在溫度突變階段,兩者應(yīng)變差值更加明顯。這可能是由于兩種POP的焊點(diǎn)大小和封裝尺寸不同帶來的影響。綜上所述,本文通過實(shí)驗(yàn)測(cè)試和模擬的方法對(duì)溫度環(huán)境下POP封裝進(jìn)行了可靠性分析。對(duì)比了不同溫度環(huán)境下相同尺寸POP以及不同尺寸POP相同溫度環(huán)境下的可靠性。同時(shí),對(duì)比了實(shí)驗(yàn)結(jié)果與有限元模擬結(jié)果,驗(yàn)證了模型的正確性。本文分析結(jié)果可以為以后的POP封裝測(cè)試以及可靠性分析提供參考依據(jù)。
[Abstract]:With the rapid development of information technology, the semiconductor industry has made continuous progress. As an important part of semiconductor industry, package testing plays an important role in the overall performance and quality of IC products. Nowadays, with the rapid development of mobile electronics market, many consumer electronic products, such as mobile phones, tablets, cameras and so on, begin to be packaged in the form of POP (package-on-package), and their reliability is paid more and more attention. More new products are required to improve the performance of products while reducing the size of products, the emergence of POP to meet such requirements, began to be widely used. However, due to the increasing of packaging density, the reliability of electronic products will be affected by heat accumulation. In this paper, the reliability of POP packaging in temperature environment is studied. The main work is as follows: the strain characteristics of 14mm POP chip under temperature shock environment are tested by experimental method, and the strain values of top layer and bottom solder joint are obtained. The 14mm and 15mm POP chips were tested under the coupled environment of temperature cycling and temperature shock, and the strain values of the top and bottom solder joints were obtained. Regardless of the temperature impact environment or the off-line coupling environment, the strain of the top solder joint and the bottom solder joint of POP show periodic variation law, and the strain of the bottom solder joint is larger than that of the top layer solder joint as a whole during the impact process. According to the strain value, the corresponding reliability life can be obtained. Finite element analysis under POP temperature impact environment shows that the stress is mainly focused on solder joints and chips. The maximum stress of the bottom chip is greater than that of the top two chips. The stress of bottom solder joint is larger than that of top layer solder joint, and the maximum stress of bottom solder joint is at the corner of the outer ring. The strain changes of the same chip under temperature shock and off-line coupling are compared. The solder joint strain starts from zero under temperature shock, while the strain under off-line coupling has a starting value. The results show that the temperature cycle produces a certain residual stress in the off-line coupling experiment. The strain of solder joint in the off-line coupling environment is larger than that in the temperature impact environment, and the solder joint is more prone to failure. The results of packaging tests of different sizes under the same temperature cycle and temperature shock coupling environment are compared and analyzed. The initial strain values of 14mm POP and 15mm POP are not zero, and the strain of 15mm POP is larger than that of 14mm POP on the whole. Especially in the temperature abrupt phase, the strain difference between the two is more obvious. This may be due to the difference in solder joint size and package size between the two POP types. To sum up, the reliability of POP packaging under temperature environment is analyzed by means of experimental test and simulation. The reliability of the same size POP and different size POP at the same temperature were compared. At the same time, the correctness of the model is verified by comparing the experimental results with the finite element simulation results. The results of this paper can provide reference for POP packaging test and reliability analysis.
【學(xué)位授予單位】：江蘇大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2016
【分類號(hào)】：TN405

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本文編號(hào)：2342760